Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: A module for use in a hardware platform for networking, computing, or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side; at least one component mounted on the secondary side, the at least one component being placed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side; and a floating heatsink assembly disposed on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member arranged within a limited vertical space on the secondary side.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A coolant distribution manifold assembly for use in a module or circuit pack of an optical networking system, including: a body defining a main inlet port at one end, a main outlet port at another end, and a plurality of cooling plate inlet ports and cooling plate outlet ports disposed between the main inlet port and the main outlet port; where the body further defines an upper internal plenum and a lower internal plenum each coupled to one of the main inlet port and the plurality of cooling plate inlet ports and the main outlet port and the plurality of cooling plate outlet ports. Optionally, the upper internal plenum and the lower internal plenum each have a variable cross-sectional area along a length of the body between the main inlet port and the main outlet port.

Abstract: A convection cooling assembly for a pluggable optical module (POM), the convection cooling assembly including: a printed circuit board (PCB) assembly; and a POM cage coupled to the PCB assembly and adapted to receive a POM adjacent to the PCB assembly; where the PCB assembly defines a cutout or a recess within the POM cage and adapted to be disposed adjacent to a surface of the POM when the POM is received within the POM cage. The cutout or the recess includes a main channel and one or more side channels disposed orthogonal or at an angle to the main channel.

Abstract: A pluggable optical module, including: a body; a coldplate coupled to the body; and a pair of cooling fluid supply and return line quick disconnects coupled to the coldplate and extending from the coldplate and the body. Optionally, the coldplate is integrated into the body. Alternatively, the coldplate is coupled adjacent to an exterior surface of the body using one or more securement mechanisms, and a thermal interface material is disposed between the coldplate and the exterior surface of the body. The body and the coldplate are adapted to be inserted into a host card, circuit pack, or module as an integrated unit, with the pair of cooling fluid supply and return line quick disconnects adapted to fluidly engage a corresponding pair of cooling fluid supply and return line quick disconnects coupled to fluid supply and return manifolds or plenums disposed in the host card, circuit pack, or module.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

Abstract: A shelf system for use in a telecommunications or networking application, including a shelf assembly and a circuit card assembly conformally inserted into the shelf assembly. The circuit card assembly includes a printed circuit board assembly disposed in a case and a plurality of fabric ports coupled to the printed circuit board and accessible from a rear facing side of the case. The shelf assembly includes a housing defining an opening on a rear facing side of the housing adapted to provide access to the plurality of fabric ports from the rear facing side of the housing. The circuit card assembly further includes a plurality of client ports accessible from a front facing side of the case and the housing of the shelf assembly further defines an opening on a front facing side of the housing adapted to provide access to the plurality of client ports from the front facing side of the housing.

Abstract: An optical system including: a faceplate including a receptacle adapted to receive a pluggable optical module; and one or more of: a thermal pad disposed adjacent to at least one interior side of the receptacle, wherein the thermal pad is adapted to be in thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from a nose of the pluggable optical module to the faceplate; and a heat sink disposed at an interior side of the receptacle, wherein the heatsink is adapted to be in physical contact and thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from the nose of the pluggable optical module to an air flow present behind the faceplate.

Abstract: A networking hardware system includes a housing; a board located in the housing and comprising a plurality of components; a liquid cooled heat exchanger; and one or more fans disposed near the liquid cooled heat exchanger and configured to provide cool airflow from the liquid cooled heat exchanger to any of the plurality of components. The housing can be substantially sealed from an external environment and includes no air intake thereon, removing a need for higher powered fans and for air filtering for dust. The housing can include a faceplate with no air intake thereon, providing increased density for ports on the faceplate.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

Abstract: A shelf system for use in a telecommunications or networking application, the shelf system including a shelf assembly and a circuit pack conformally inserted into the shelf assembly. The circuit pack includes a printed circuit board disposed in an enclosure, an integrated circuit chip coupled to the printed circuit board, and a plurality of ports coupled to the printed circuit board and disposed around the integrated circuit chip. The ports of the plurality of ports are angled relative to a front faceplate of the enclosure such that lengths of tracks between the ports and the integrated circuit chip are less than a predetermined maximum length.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: A networking hardware system includes a housing; a board located in the housing and comprising a plurality of components; a liquid cooled heat exchanger; and one or more fans disposed near the liquid cooled heat exchanger and configured to provide cool airflow from the liquid cooled heat exchanger to any of the plurality of components. The housing can be substantially sealed from an external environment and includes no air intake thereon, removing a need for higher powered fans and for air filtering for dust. The housing can include a faceplate with no air intake thereon, providing increased density for ports on the faceplate.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.