Abstract: A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.

Abstract: A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.

Abstract: A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.

Abstract: A method of integrated circuit (IC) disposition includes the steps of determining one or more disposition criteria based at least in part on statistical timing of a given IC design; and determining whether a given IC according to the given IC design satisfies the one or more disposition criteria based at least in part on one or more measurements of at least one test structure.

Abstract: A method for reticle design correction and electrical parameter extraction of a multi-cell reticle design. The method including: selecting a subset of cell designs of a multi-cell reticle design, each cell design of the subset of cell designs having a corresponding shape to process, for each cell design of the subset of cell designs determining a respective cell design location of the corresponding shape; determining a common shapes processing rule for all corresponding shapes of each cell design based on the respective cell design locations of each of the corresponding shapes; and performing shapes processing of the corresponding shape only of a single cell design of the subset of cell designs to generate resulting data for the subset of cell designs. Also a computer usable medium including computer readable program code having an algorithm adapted to implement the method for reticle design correction and electrical extraction.

Abstract: A computerized tool or method that calculates the capacitance and resistance of each global wire on the chip, one wire at a time. The invention steps along a track containing a wire segment, grid point by grid point, calculating the resistance and capacitance at that point. At each grid point it searches the neighboring tracks within the surrounding cube for adjacent elements that could cause capacitive effects or affect the resistance of the wire. The method delivers capacitance and resistance values for each process condition for a grid unit length of wire, given the wire type and 3 dimensional environment of the wire segment. The capacitance and resistance at a grid point along the wire are generally determined by one table lookup for wire types based on the surrounding environment. These values are added along wire segments to deliver accurate 3 dimensional capacitances and resistances.