Abstract: There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.

Abstract: There is provided a tape comprising a polypropylene backing having a thickness of at least 0.0254 mm and a synthetic rubber pressure sensitive adhesive having a thickness of at least 0.0229 mm, wherein the tape has a ratio of pressure sensitive adhesive to polypropylene backing thickness of at least 0.7:1.

Abstract: Tamper indicating articles that include a surface-feature image-generating layer and an adhesive layer are described. The surface-feature image-generating layer generates a visible, surface-feature-generated image upon exposure to light. The intensity of the surface-feature-generated image is reduced when taped-over. Single-image and dual-image tamper indicating articles are also described, including buried dual-image and adjacent dual-image tamper indicating articles.

Abstract: A radio-frequency identification tag and tape applicator. A preferred embodiment of the invention provides an applicator that includes a tag and tape handling system having a base, a tape supply holder attached to the base, a tag supply holder attached to the base, a tag applying mechanism attached to the base for applying a tag to a length of tape and that includes a taping head for applying the tag and the length of tape to an object. A preferred embodiment of the invention provides a radio-frequency identification tag applicator that includes a tag supply holder, a carrier roll holder, a carrier path from the supply roll holder to the carrier roll holder, a tag dispensing mechanism along the carrier path between the supply roll holder and the carrier roll holder for applying a tag to an object, and an interrogator for writing information to tags along the carrier path between the tag supply holder and the tag dispensing mechanism.

Abstract: The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above.

Abstract: An asset tracking system is provided, having particular usefulness in connection with the interrogation of RFID-tagged pallets by a forklift equipped with one or more RFID reader antennas. A useful embodiment of an RFID-tagged pallet is described, along with other beneficial components of such a system.

Abstract: A radio-frequency identification tag and tape applicator. A preferred embodiment of the invention provides an applicator that includes a tag and tape handling system having a base, a tape supply holder attached to the base, a tag supply holder attached to the base, a tag applying mechanism attached to the base for applying a tag to a length of tape and that includes a taping head for applying the tag and the length of tape to an object. A preferred embodiment of the invention provides a radio-frequency identification tag applicator that includes a tag supply holder, a carrier roll holder, a carrier path from the supply roll holder to the carrier roll holder, a tag dispensing mechanism along the carrier path between the supply roll holder and the carrier roll holder for applying a tag to an object, and an interrogator for writing information to tags along the carrier path between the tag supply holder and the tag dispensing mechanism.

Abstract: An asset tracking system is provided, having particular usefulness in connection with the interrogation of RFID-tagged pallets by a forklift equipped with one or more RFID reader antennas. A useful embodiment of an RFID-tagged pallet is described, along with other beneficial components of such a system.

Abstract: A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure.

Abstract: Disclosed is an anisotropic conductive adhesive having an adhesive layer and conductive particles individually adhered to the adhesive layer, the conductive particles being arranged in an ordered array. The size of the conductive particles is at least somewhat smaller than the thickness of the adhesive layer. Also disclosed is an anisotropic conductive adhesive having an adhesive layer, conductive particles individually adhered to the adhesive layer, and a release liner having an ordered array of dimples. The conductive particles reside in a single layer in the dimples. The anisotropic conductive adhesive is made by placing the conductive particles in an ordered array of dimples on a low adhesion surface. An adhesive layer is then laminated on top such that the conductive particles individually adhere to the adhesive layer. The anisotropic conductive adhesive may be used to electrically connect fine pitch electrodes on opposing circuit layers.

Abstract: The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of the steps pre-applying adhesive directly to a bumped side of integrated circuit chip. The method also includes the step of pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Abstract: The present invention relates to a deformable substrate assembly for microelectronic components which includes an array of ductile metal circuit traces on a surface thereof. When an electronic component is adhesively bonded to the substrate assembly, and bonding elements from the component contact the traces, the substrate has material properties which allow individual bonding elements to locally deform the traces until the traces penetrate into the substrate surface.

Abstract: Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.

Abstract: The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the reaction product of an admixture of an effective amount of a curable cyanate ester resin, a thermoplastic polymer, and a curing catalyst. The catalyst may be, for example, thermally or photochemically activated.