Abstract: A thermoelectric heat pump having first and second substrates with first and second copper metalizations formed thereon. The first and second copper metalizations are coated with nickel for soldering with a 90-10 lead-antimony solder having a eutectic temperature of about 251 degrees Celsius to nickel plates coated on first and second ends of n-type and p-type thermoelectric elements. The n-type and p-type semiconductor elements are arranged in an array of rows and columns with alternatively n-type and p-type elements connected in series with a first n-type element having a lead for connection to first terminal of a dc power source and a last p-type element having a lead for connection to a second terminal of a dc power source.