Patents by Inventor Peter BAINSCHAB

Peter BAINSCHAB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE
    Publication number: 20210395076
    Abstract: A wafer-level package for micro-acoustic devices and a method of manufacture is provided. The package comprises a base wafer with electric device structures. A frame structure is sitting on top of the base wafer enclosing particular device areas for the micro-acoustic devices. A cap wafer provided with a thin polymer coating is bonded to the frame structure to form a closed cavity over each device area and to enclose within the cavity the device structures arranged on the respective device area.
    Type: Application
    Filed: December 13, 2019
    Publication date: December 23, 2021
    Inventors: Manuel HOFER, Rodrigo PACHER FERNANDES, Stefan Leopold HATZL, Josef EHGARTNER, Peter BAINSCHAB
  • Integration of through glass via (TGV) filter and acoustic filter
    Patent number: 10582609
    Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 3, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, Jonghae Kim, Xiaoju Yu, Mario Francisco Velez, Wei-Chuan Chen, Niranjan Sunil Mudakatte, Matthew Michael Nowak, Christian Hoffmann, Rodrigo Pacher Fernandes, Manuel Hofer, Peter Bainschab, Edgar Schmidhammer, Stefan Leopold Hatzl
  • INTEGRATION OF THROUGH GLASS VIA (TGV) FILTER AND ACOUSTIC FILTER
    Publication number: 20190132942
    Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 2, 2019
    Inventors: Changhan Hobie YUN, Jonghae KIM, Xiaoju YU, Mario Francisco VELEZ, Wei-Chuan CHEN, Niranjan Sunil MUDAKATTE, Matthew Michael NOWAK, Christian HOFFMANN, Rodrigo PACHER FERNANDES, Manuel HOFER, Peter BAINSCHAB, Edgar SCHMIDHAMMER, Stefan Leopold HATZL