Abstract: A measuring microscope arrangement is disclosed which includes a measuring microscope having a measuring head configured as a component which can be mounted on the microscope. The measuring head is suitable for the microdensitometric measurement of line widths as well as for the spectral interferometric measurement of thicknesses of objects such as semiconductor wafers, for example. In a first preferred embodiment of the arrangement of the invention, the object is scanned by displacing the object with the aid of a piezo table mounted on a scanning table utilized for obtaining a coarse position of the field of the object. The measuring microscope arrangement includes an objective for defining an intermediate image and the arrangement includes a measuring diaphragm mounted in the intermediate image. A diode-array spectrometer and an integral receiver are arranged behind the stationary diaphragm.