Abstract: An imprint lithography apparatus is disclosed, the apparatus including a substrate table arranged to support a substrate having a first surface to be imprinted and a second surface, facing the substrate table, comprising a substrate alignment mark, a template holder arranged to hold a template to imprint the first surface of the substrate, and an alignment system arranged to align the template to a substrate alignment mark provided on the substrate, wherein the substrate table further comprises a substrate table optical system to allow the substrate alignment mark to be viewed by the alignment system.

Abstract: A method of pre-aligning a substrate in a lithographic apparatus is described. The substrate has at least one alignment mark provided on a side of the substrate. The method includes determining a relationship between a position of the at least one alignment mark, at least part of an edge of the substrate, and a center of the substrate. A substrate support is provided to support a substrate, the substrate support having at least one optical view window at a predetermined location to view a part of the side of the substrate. The substrate is placed on the substrate support on the basis of the relationship to position the at least one alignment mark in the at least one optical view window.

Abstract: A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.

Abstract: A particulate pre-reduction cobalt supported Fischer-Tropsch synthesis catalyst precursor which comprises a catalyst support impregnated with cobalt, is treated with a pure hydrogen reducing gas, at a first specific feed gas space velocity, SV1, and at a first heating rate, HR1, to obtain a partially reduced precursor. The support contains reducible cobalt oxide in a calcined state and having a formula-unit in which each mole of cobalt atoms is associated with more than 4/3 moles of oxygen atoms and displaying a reducible cobalt oxide specific surface area at least equal to that of Co3O4 spinel. The partially reduced precursor is then treated with a pure hydrogen reducing gas, at a second specific feed gas space velocity, SV2, and at a second heating rate, HR2, to obtain an activated supported Fischer-Tropsch catalyst, with SV2?SV1 and/or HR2?HR1; however, when SV2=SV1, HR2?HR1 and when HR2=HR1, SV2?SV1.

Abstract: In a method according to one embodiment of the invention, a plurality of markers are printed in resist on a substrate at a range of angles relative to a crystal axis of the substrate. The markers are etched in to the substrate using an anisotropic etch process, such that after the etch the apparent positions of the markers are dependent on their orientation relative to the crystal axis. The apparent positions of the markers are measured, and from this information the orientation of the crystal axis is derived.