Abstract: The present invention relates to a shaving device includes a housing with a skin contacting surface and at least one cutting blade mounted in the housing, wherein the cutting blade has an asymmetric cross-sectional shape with a first face, a second face opposed to the first face and a cutting edge at the intersection of the first face and the second face. An intersecting line connects the primary bevel of the first face and the secondary bevel of the second face such that a first wedge angle q1 and a second wedge angle q2 are formed. Further, the clearance angle ? between the skin contacting surface and the primary bevel of the first surface is ?11°, the effective cutting angle ? between the skin contacting surface and the bisecting line of the first wedge angle q1 is ?10° and q1>q2.

Abstract: The present invention relates to a cutting element having a substrate with at least one aperture which includes a cutting edge along at least a portion of an inner perimeter of the aperture. The cutting edges have an asymmetric cross-sectional shape with a first face, a second face opposed to the first face and a cutting edge at the intersection of the first face and the second face. Moreover, the present invention relates to a hair removal device including such cutting elements.

Abstract: The present invention relates to a skin treatment sheet comprising a substrate with a plurality of apertures wherein the sheet has a first surface and an opposing second surface. The apertures have a first and second inner perimeter and a cutting edge along at least a portion of the first inner perimeter. The skin treatment sheet has a stability ST which is the ratio of the average cross-sectional substrate area Ax and the total aperture area A1. Moreover, the present invention also relates to a skin treatment device comprising this skin treatment sheet.

Abstract: The present invention relates to a cutting element having a substrate with at least one aperture which has a cutting edge along at least a portion of an inner perimeter of the aperture. The cutting edges have an asymmetric cross-sectional shape with a first face, a second face opposed to the first face and a cutting edge at the intersection of the first face and the second face. Moreover, the present invention relates to a hair removal device including such cutting elements.

Abstract: The present invention relates to a cutting element having a substrate with at least one aperture which includes a cutting edge along at least a portion of an inner perimeter of the aperture. The cutting edges have an asymmetric cross-sectional shape with a first face, a second face opposed to the first face and a cutting edge at the intersection of the first face and the second face.

Abstract: The present invention relates to a skin treatment sheet including a substrate with a plurality of apertures wherein the apertures have a first and second inner perimeter and a cutting edge along at least a portion of the first inner perimeter. The skin treatment sheet has a total cutting length which is the total length of all portions of the first perimeter in each aperture that contain a cutting edge and a total aperture area wherein the ratio of total aperture area to total cutting length is in a predefined range from 0.08 to 2.0 mm. Moreover, the present invention also relates to a skin treatment device including this skin treatment sheet.

Abstract: The present invention relates to a cutting blade having an asymmetric cross-sectional shape with a first face, a second face opposed to the first face and different from the first face as well as a cutting edge wherein the first face comprises a surface and the second face comprises a primary bevel, a secondary bevel and a tertiary bevel with a first wedge angle ?1 between the surface on the first face and the primary bevel, a second wedge angle ?2 between the surface on the first face and the secondary bevel and a third wedge angle ?3 between the surface on the first face and the tertiary bevel. Moreover, the present invention relates to a hair removal device comprising this cutting blade.

Abstract: The present invention relates to a cutting blade having a blade body with a first material joined to a second material, a first face, a second face opposed to the first face, and a cutting edge, where the first face includes a first surface, and the second face includes a primary bevel having a convex or straight cross-sectional shape and a secondary bevel having a concave cross-sectional shape with a line connecting the two bevels, the primary bevel extending from the cutting edge to the line, where cutting edge and primary bevel are shaped in the second material. A first wedge angle ?1 between the first surface and the primary bevel or the tangent of the primary bevel through the cutting edge is greater than a second wedge angle ?2 between the first surface and the tangent of the secondary bevel. A hair removal device includes this cutting blade.

Abstract: The present invention is directed to a shaving device including a housing with a skin contacting surface and at least one cutting blade mounted in the housing, wherein the at least one cutting blade has an asymmetric cross-sectional shape with a first face, a second face opposed to the first face as well as a cutting edge at the intersection of the first face and the second face. The blade is mounted in the housing such that the clearance angle ? between the skin contacting surface and the primary bevel of the first face or the secondary bevel of the second face is ?11°, the effective cutting angle ? between the skin contacting surface and the bisecting line of the first wedge angle ?1 between the first surface and the primary bevel is ?10° and ?1>second wedge angle ?2 between the first surface and secondary bevel.

Abstract: The present invention relates to a cutting blade having a first face, a second face opposed to the first face and different from the first face as well as a cutting edge at the intersection of the first face and the second face. The first face comprises a first surface and a primary bevel with a first wedge angle ?1 between the first surface and the primary bevel. The second face comprises a secondary bevel and a tertiary bevel with a second wedge angle ?2 between the first surface on the first face and the secondary bevel and a third wedge angle ?3 between the first surface on the first face and the tertiary bevel, where ?1>?2 and ?2<?3. Moreover, the present invention relates to a hair removal device comprising this cutting blade.

Abstract: This invention belong to a mounting technology for aligning parts, a self-aligned elastic positioning. A problem this invention solves is alignment of parts without using mechanical fine pre-alignment. Wherein one part has elastic bumps, another part has V-grooves and the parts fit into each other. The invention is using elastic material for the bumps to fit the V-grooves. Whereas the bumps are made of elastic material and shaped partly to the V-bumps by moulding. The two parts can slide along in the direction perpendicular to the plane of the surface of the part. The movement in the perpendicular direction can be controlled by an external force. This means that the bumps and V-grooves have good alignment in xy-orientation and are also partial aligned in z-orientation. The elasticity of the bumps allows for thermal expansion differences without stresses to the parts while maintaining high precision alignment at a point.

Abstract: A via structure is obtained by etching a through-hole in a substrate on the via location and placing transmission lines on declining or sloping sidewalls of the hole. The lines continue to conductors on the other surface of the substrate through vias located in a free portion of a thin film structure at the bottom side of the substrate. The free portion is so strong and large, that several vias can be made therein for connection to a plurality of parallel lines forming e.g. a bus structure. The large free portion can be additionally supported by a thick support layer applied on top of the layers in the hole. By applying an isolated ground plane and a dielectric layer between the substrate and the transmission lines, the transmission lines on the sloping sidewalls of the via hole structure can be made impedance matched. The sloping sidewalls of the via hole can easily be obtained using a V-groove etch for a monocrystalline Si-substrate.

Abstract: This invention relates to a manufacturing process for making elastic bumps in the micro-electronic field. It solves the problem to mould micrometer sized elastic features by means of a micro-machined mould. The method is a reproducible moulding technology to achieve elastic bumps being a perfect replication of the mould. The mould is made of one or several grooves etched in a silicon wafer. The method includes the steps of: cleaning the surface of the mould (100) from dust and other particles; depositing a release agent on the mould and the release agent, e.g. Parylene or silane, forming a conformal self-assembled layer (118) on the surface of the mould; putting on a curable elastomer, to form an elastomeric structure (208) on the mould; curing the mould and the structure; and separating the structure from the mould.

Abstract: A self-aligning, flexible high density and impedance adjusted electrical connectors for use in microelectronic systems for overcoming the problem of having electrical connection and alignment at the same time is disclosed. The connector comprises a first part (204) consisting of two metal layer structures, a first signal path (212) and a first ground path (210) covering a V-groove (202), and a second part (208) consisting of corresponding metal layers of the first part, a second signal path (224) covering an elastic bump (206) and a second signal ground plane (226) which fits into the V-groove (202). The first and the second signal paths are in contact with each other when the first and the second parts are brought together and the contact is self-aligning when put together. The electrical contact will remain despite displacement due to thermal expansion.

Abstract: A growth substrate having growth nuclei made of diamond and/or diamond-like carbon arranged on its growth surface, the orientation of over 50% of the growth nuclei deviating by less than 10.degree. from the crystal orientation defined by the growth substrate corresponding to Miller's indices (h, k, l) and the nucleus density changes between the center of the growth substrate and a distance of maximally 15 mm from the center by maximally 80%. The method also relates to a process for the growth substrate's manufacture.

Abstract: A mounting structure for a self-aligned flip-chip with elastic contacts. The mounting structure provides non-permanent joints combined with auto-aligning structures, and offers a symmetrical elastic alignment ensuring continued centering of the parts. This is done by using a flip-chip structure 200, which is based on a substrate 202 with an elastomer bump structure 204, molded by using anisotropically etched silicon as a mold. The pattern of elastic bumps 204 on the substrate correspond to a pad pattern 210 on a flip-chip 214. The bumps 204 can be coated with gold, and serve both as electrical contacts 206 and for vertical positioning. A guiding frame 212 of an elastomeric material with inclined frame walls 220 is provided around the bumps and is the same shape as the inclined walls 222 of the flip-chip 214.