Patents by Inventor Peter Bosk

Peter Bosk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a patterned metal-containing layer on a semiconductor wafer
    Patent number: 6593228
    Abstract: A metal-containing layer is formed on a substrate. A mask layer is formed on the metal-containing layer. The mask layer is patterned by way of a lithographically fabricated mask. The metal-containing layer is patterned with the patterned mask layer, to thereby form an electrode out of the metal-containing layer. A protective layer is deposited on the mask layer and on the substrate. The protective layer undergoes chemical mechanical polishing, during which the protective layer is removed and the electrode is uncovered.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: July 15, 2003
    Assignee: Infineon Technologies AG
    Inventors: Volker Weinrich, Gerhard Beitel, Andreas Hauser, Peter Bosk
  • Method of fabricating a patterned metal-containing layer on a semiconductor wafer
    Publication number: 20020160596
    Abstract: A metal-containing layer is formed on a substrate. A mask layer is formed on the metal-containing layer. The mask layer is patterned by way of a lithographically fabricated mask. The metal-containing layer is patterned with the patterned mask layer, to thereby form an electrode out of the metal-containing layer. A protective layer is deposited on the mask layer and on the substrate. The protective layer undergoes chemical mechanical polishing, during which the protective layer is removed and the electrode is uncovered.
    Type: Application
    Filed: April 12, 2002
    Publication date: October 31, 2002
    Inventors: Volker Weinrich, Gerhard Beitel, Andreas Hauser, Peter Bosk