Abstract: An aircraft solid state power controller comprises a feed node to be electrically connected to a primary electric power supply; a load node to be electrically connected to at least one electric load; and at least one electric switching device, in particular a solid state switching device, which is arranged between the feed node and the load node. The at least one electric switching device is switchable between an on-state, in which the at least one electric switching device provides a low-resistive electric connection between the feed node and the load node; and an off-state, in which the at least one electric switching device electrically isolates the load node from the feed node.

Abstract: The present invention relates to a power semiconductor chip module, comprising a substrate having a top side and a bottom side; at least one first power semiconductor device attached to the top side of the substrate; at least one first conductive structure thermally and electrically connecting the first power semiconductor device to the top side of the substrate; at least one second power semiconductor device attached to the bottom side of the substrate; and at least one second conductive structure connecting the second power semiconductor device to the bottom side of the substrate.

Abstract: A power distribution system configured to supply electric power from a power supply to at least one load, includes at least two solid state power controllers connected in parallel, each solid state power controller includes: a solid state switching device having a first terminal (D) connected to the power supply, and a second terminal (S) connected to the load, and is configured to switch between an OFF operation mode in which the second terminal (S) is electrically disconnected from the power supply, and an ON operation mode in which the second terminal (S) is electrically connected to the power supply. The system also includes a load current detection unit configured to detect a load current through the solid state switching device.

Abstract: The present invention relates to a power semiconductor chip module, comprising a substrate having a top side and a bottom side; at least one first power semiconductor device attached to the top side of the substrate; at least one first conductive structure thermally and electrically connecting the first power semiconductor device to the top side of the substrate; at least one second power semiconductor device attached to the bottom side of the substrate; and at least one second conductive structure connecting the second power semiconductor device to the bottom side of the substrate.

Abstract: A power distribution system configured to supply electric power from a power supply to at least one load, includes at least two solid state power controllers connected in parallel, each solid state power controller includes: a solid state switching device having a first terminal (D) connected to the power supply, and a second terminal (S) connected to the load, and is configured to switch between an OFF operation mode in which the second terminal (S) is electrically disconnected from the power supply, and an ON operation mode in which the second terminal (S) is electrically connected to the power supply. The system also includes a load current detection unit configured to detect a load current through the solid state switching device.

Abstract: A solid state power controller including: a plurality of pairs of FETs connected in parallel, each pair comprising a first, forward-facing FET and a second, backward-facing FET connected by their respective sources; gate drive means for switching said FETs on and off; and means for isolating the sources of the backwards-facing FETs of the plurality of pairs of FETs from each other and operating the backwards-facing FETs in 3rd quadrant operation mode.

Abstract: A solid state power controller including: a plurality of pairs of FETs connected in parallel, each pair comprising a first, forward-facing FET and a second, backward-facing FET connected by their respective sources; gate drive means for switching said FETs on and off; and means for isolating the sources of the backwards-facing FETs of the plurality of pairs of FETs from each other and operating the backwards-facing FETs in 3rd quadrant operation mode.

Abstract: A current measurement and comparing assembly for a power distribution system includes a solid state contactor module having a control section and a power section, wherein the power section includes at least one solid state switch. Also included is a current sensor disposed in the control section and in operable communication with the at least one solid state switch, wherein the current sensor distributes current data to a switch control configured to control the at least one solid state switch and distributes current data to a current measurement and comparison circuit.