Abstract: A battery, a battery element and a method for forming a battery element are provided. In an embodiment, a battery element includes a substrate with a plurality of trenches extending into the substrate, wherein a part of a trench of the plurality of trenches is filled with a solid state battery structure, and wherein the trench of the plurality of trenches comprises a cavity.

Abstract: According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact exposed on a surface of the wafer; an adhesive layer structure disposed over the surface of the wafer, the adhesive layer structure covering the at least one electronic contact; and a carrier adhered to the wafer via the adhesive layer structure, wherein the carrier may include a contact structure at a surface of the carrier aligned with the at least one electronic contact so that by pressing the wafer in direction of the carrier, the contact structure can be brought into electrical contact with the at least one electronic contact of the at least one electronic component.

Abstract: A battery, a battery element and a method for forming a battery element are provided. In an embodiment, a battery element includes a substrate with a plurality of trenches extending into the substrate, wherein a part of a trench of the plurality of trenches is filled with a solid state battery structure, and wherein the trench of the plurality of trenches comprises a cavity.

Abstract: According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact exposed on a surface of the wafer; an adhesive layer structure disposed over the surface of the wafer, the adhesive layer structure covering the at least one electronic contact; and a carrier adhered to the wafer via the adhesive layer structure, wherein the carrier may include a contact structure at a surface of the carrier aligned with the at least one electronic contact so that by pressing the wafer in direction of the carrier, the contact structure can be brought into electrical contact with the at least one electronic contact of the at least one electronic component.

Abstract: A battery includes at least two externally accessible battery electrodes to provide a supply voltage and at least more than half of a wafer including at least two wafer electrodes. The wafer includes a plurality of trenches reaching into the wafer. At least a part of a trench of the plurality of trenches is filled with a solid state battery structure. The solid state battery structure within the trench includes electrodes electrically connected to the wafer electrodes.

Abstract: According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact exposed on a surface of the wafer; an adhesive layer structure disposed over the surface of the wafer, the adhesive layer structure covering the at least one electronic contact; and a carrier adhered to the wafer via the adhesive layer structure, wherein the carrier may include a contact structure at a surface of the carrier aligned with the at least one electronic contact so that by pressing the wafer in direction of the carrier, the contact structure can be brought into electrical contact with the at least one electronic contact of the at least one electronic component.

Abstract: A battery includes at least two externally accessible battery electrodes to provide a supply voltage and at least more than half of a wafer including at least two wafer electrodes. The wafer includes a plurality of trenches reaching into the wafer. At least a part of a trench of the plurality of trenches is filled with a solid state battery structure. The solid state battery structure within the trench includes electrodes electrically connected to the wafer electrodes.

Abstract: According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact exposed on a surface of the wafer; an adhesive layer structure disposed over the surface of the wafer, the adhesive layer structure covering the at least one electronic contact; and a carrier adhered to the wafer via the adhesive layer structure, wherein the carrier may include a contact structure at a surface of the carrier aligned with the at least one electronic contact so that by pressing the wafer in direction of the carrier, the contact structure can be brought into electrical contact with the at least one electronic contact of the at least one electronic component.

Abstract: Detecting arcing events in a DC driven semiconductor tool is a challenging process. Various embodiments comprise dedicated sensor devices capable of detecting arcing events by observing the slope of voltage and/or current of a DC power supply line. Using the incorporated interfaces, the sensor could be connected to a computer system. Besides the detector arrangement the unit also provides a method and a corresponding computer program product. Furthermore a simple detection, the unit has the capability of separating the events into its severeness.

Abstract: The invention relates to an electro-optical arrangement for coupling light signals into an optical waveguide, which has a laser diode for emitting light signals and a microlens, which focuses light signals emitted by the laser for coupling into the optical waveguide. According to the invention, the microlens is arranged on a carrier carrying the laser diode.

Abstract: The invention relates to an optoelectronic module for coupling light signals into and out of an optical waveguide. The module has a carrier having at least a first side, a light transmitter for emitting light signals, which is arranged on the carrier, a receiver for detecting light signals, which is arranged on the carrier, and a beam-shaping element for coupling light signals of the laser diode out of the module and for coupling light signals into the receiver. The light transmitter and the receiver are both arranged on the first side of the carrier, a shielding means serving to shield the receiver from optical and/or electrical interference signals. As a result, a bidirectional optoelectronic module is provided which is distinguished by signal conversion that is as precise as possible and, at the same time, is comparatively cost-effective in terms of production.

Abstract: The invention relates to an electro-optical arrangement for coupling light signals into an optical waveguide, which has a laser diode for emitting light signals and a microlens, which focuses light signals emitted by the laser for coupling into the optical waveguide. According to the invention, the microlens is arranged on a carrier carrying the laser diode.

Abstract: An optical coupling unit for the coupling of at least one optoelectronic converter to an assigned optical waveguide. The coupling unit includes a monolithic glass block in which at least one integrated light guiding channel is produced by changing the refractive index of the glass material using laser irradiation. The glass block has at least one reflection surface, at which light signals are deflected between a light receiving surface and a light transmitting surface. The coupling unit provides a simple configuration including few components, can be produced by means of an automated production process and can be variably adapted to the given circumstances.

Abstract: The mast foot mounting system for a sailboard in accordance with the invention comprises a slide track and a sliding shoe supported for displacement in the slide track and carrying the mast foot and adapted to be locked firmly in a plurality of positions along the slide track. An actuator always remaining in a fixed position is disposed at the sternward end of the slide track for release of the lock. The narrow sliding shoe is provided in front of the mast foot pin with a safety fastener which permits adjustment of the overload at which the mast foot pin is set free by the safety fastener.