Abstract: The present disclosure provides techniques and solutions for obtaining state of charge estimates for one or more battery cells. A set of values is obtained for a set of one or more battery cells. The set of values includes a least one voltage measurement, at least one present current measurement, and at least one temperature measurement. The set of input values is submitted to a state of charge estimation model, as well as at least one prior current value for the set of one or more battery cells. A state of charge estimate is received for the set of one or more battery cells. In various implementations, the state of charge estimation model can be implemented as a machine learning model or as a lookup table. An estimate from the charge estimation model may be combined with one or more other state of charge estimates.

Abstract: Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.

Abstract: An electronic circuit with repetitive patterns formed by shadow mask vapor deposition includes a repetitive pattern of electronic circuit elements formed on a substrate. Each electronic circuit element includes the following elements in the desired order of deposition: a first semiconductor segment, a second semiconductor segment, a first metal segment, a second metal segment, a third metal segment, a fourth metal segment, a fifth metal segment, a sixth metal segment, a first insulator segment, a second insulator segment, a third insulator segment, a seventh metal segment, an eighth metal segment, a ninth metal segment and a tenth metal segment. All of the above segments may be deposited via a shadow mask deposition process. The electronic circuit element may be an element of an array of like electronic circuit elements.

Abstract: An electronic circuit with repetitive patterns formed by shadow mask vapor deposition includes a repetitive pattern of electronic circuit elements formed on a substrate. Each electronic circuit element includes the following elements in the desired order of deposition: a first semiconductor segment, a second semiconductor segment, a first metal segment, a second metal segment, a third metal segment, a fourth metal segment, a fifth metal segment, a sixth metal segment, a first insulator segment, a second insulator segment, a third insulator segment, a seventh metal segment, an eighth metal segment, a ninth metal segment and a tenth metal segment. All of the above segments may be deposited via a shadow mask deposition process. The electronic circuit element may be an element of an array of like electronic circuit elements.

Abstract: In a method of forming an electrical circuit assembly, a substrate is provided including a plurality of first segments that form an electrical circuit. The first segments have surfaces that rise above surfaces of other segments that form the electrical circuit. All of the segments are deposited on the substrate via one or more shadow mask vapor deposition processes in a vacuum. A photoresist caused to cover all of the segments is hardened and then abraded until surfaces of the first segments are exposed, but surfaces of the other segments are not exposed, and a surface of the abraded photoresist is at the same level as the exposed surfaces of the first segments. Second segments can be deposited on the exposed surfaces of the first segments via a shadow mask vapor deposition process in a vacuum to a level above the top surface of the abraded photoresist.

Abstract: Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.

Abstract: The present invention is a two-layer shadow mask with small dimension apertures and method of making and using same. The two-layer shadow mask of the present invention is suitable for use for manufacturing an electronic device via deposition in a production system. The two-layer shadow mask of the present invention is formed by a first thick mask, which includes a plurality of apertures that has been formed, for example, by etching, bonded to a second, comparatively thin mask, that has been formed by an electrolytic process, and which includes a plurality of apertures that has been patterned by a photoresist. The second mask is aligned and bonded atop the first mask, with their respective apertures desirably offset one to another. The offset amount of the respective apertures of the two-layer shadow mask determines the resulting final aperture dimension, which may approach 0 microns, through which material is deposited upon a substrate in a deposition production system.

Abstract: In a method of using and cleaning one or more shadow masks of a shadow mask vapor deposition system used to form an electronic device, a substrate is advanced through series connected deposition vacuum vessels. As the substrate advances through each deposition vacuum vessel, material from a material deposition source positioned in the deposition vacuum vessel is deposited on the substrate through a shadow mask positioned therein. The material is also deposited on a surface of the shadow mask that faces the one material deposition source. Following the deposit of material on the surface of the shadow mask in at least one deposition vacuum vessel, a reactive gas is introduced into the deposition vacuum vessel absent the substrate therein. The reactive gas is then ionized to remove the material deposited on the shadow mask.

Abstract: In a method of forming an electrical circuit assembly, a substrate is provided including a plurality of first segments that form an electrical circuit. The first segments have surfaces that rise above surfaces of other segments that form the electrical circuit. All of the segments are deposited on the substrate via one or more shadow mask vapor deposition processes in a vacuum. A photoresist caused to cover all of the segments is hardened and then abraded until surfaces of the first segments are exposed, but surfaces of the other segments are not exposed, and a surface of the abraded photoresist is at the same level as the exposed surfaces of the first segments. Second segments can be deposited on the exposed surfaces of the first segments via a shadow mask vapor deposition process in a vacuum to a level above the top surface of the abraded photoresist.

Abstract: In a method of reducing or undoing progressive threshold shift in a thin-film-transistor (TFT) circuit, first and second voltages applied to source and gate terminals of a first transistor cause the first transistor to conduct and apply the first voltage to the gate terminal of the second transistor. The first voltage applied to the gate terminal of the second transistor coacts with a reference voltage coupled to the source terminal of the second transistor via an LED element to cause the second transistor to not conduct whereupon the LED element does not receive electrical power. After a first predetermined period of time sufficient to reduce or undo a progressive threshold shift in the second transistor, the application of the first voltage to the gate terminal of the second transistor is terminated.

Abstract: A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).

Abstract: A vapor deposition shadow mask system includes a number of series connected vacuum vessels each having a material deposition source and shadow mask positioned therein. A substrate is translated along a path that has a longitudinal axis that extends through the vacuum vessels. Centers of shadow masks in first and second vacuum vessels are offset laterally on opposite sides of the longitudinal axis. The system is operative for depositing material on a second area of the substrate via the material deposition source and shadow mask in the second vacuum vessel in a manner that overlaps a portion of the material deposited on a first, adjacent area of the substrate via the material deposition source and shadow mask in the first vacuum vessel.

Abstract: A modular flat-screen television display having a large area image can be made using an array of modules of easily manufacturable size and preferably removable. The image on each module extends to the edge of the module so that when placed in the array there is no substantial interruption in the television image since the distance between modules is the same as the distance between picture elements within the modules. Control and drive circuitry enable each module to be driven at the same time, thereby decreasing the time it takes to refresh the entire display. The modules contain picture elements which may be emissive, reflective or transmissive.

Abstract: Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.