Patents by Inventor Peter Brokhman

Peter Brokhman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for testing a multi-die integrated circuit device
    Patent number: 11143703
    Abstract: A method for scan chain testing a multi-chip module including a plurality of integrated circuit dice, some of the integrated circuit dice being of a first type and some of the integrated circuit dice being of a second type, includes separately applying a first boundary scan test stream to each die of the first type, and a second boundary scan test stream to each die of the second type. Testing apparatus includes a test interface that couples to each respective test access port, and a controller configured to separately apply the first boundary scan test stream to each die of the first type, and the second boundary scan test stream to each die of the second type. A multi-chip module includes a plurality of integrated circuit dice, each having a boundary scan register chain with a test access port, and a test access port for the module as a whole.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: October 12, 2021
    Assignee: Marvell Israel (M.I.S.L) Ltd.
    Inventors: Michael Fridburg, Erez Menahem, Peter Brokhman
  • METHOD AND APPARATUS FOR TESTING A MULTI-DIE INTEGRATED CIRCUIT DEVICE
    Publication number: 20200103464
    Abstract: A method for scan chain testing a multi-chip module including a plurality of integrated circuit dice, some of the integrated circuit dice being of a first type and some of the integrated circuit dice being of a second type, includes separately applying a first boundary scan test stream to each die of the first type, and a second boundary scan test stream to each die of the second type. Testing apparatus includes a test interface that couples to each respective test access port, and a controller configured to separately apply the first boundary scan test stream to each die of the first type, and the second boundary scan test stream to each die of the second type. A multi-chip module includes a plurality of integrated circuit dice, each having a boundary scan register chain with a test access port, and a test access port for the module as a whole.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 2, 2020
    Inventors: Michael Fridburg, Erez Menahem, Peter Brokhman