Abstract: A method for the zonal polishing of a workpiece includes using a polishing tool to guide a structured polishing pad over the surface of workpiece to remove material from the workpiece. A structured polishing pad includes a structuring adapted to the movement of a polishing tool.

Abstract: Compounds of general formula I X1 is a CD2 group or a CT2 group; X2 is oxygen or a group (CZ1Z2)n, wherein Z1 and Z2 on each occurrence independently each are hydrogen, deuterium, or tritium and n is an integer from 1 to 12; X3 is a CD2 group or a CT2 group; and R is selected from the group consisting of hydroxy, -NO2, halogen, a diazonium ion, a diazonium salt, a trialkylammonium ion, a trialkylammonium salt, a dialkoxyarene, a sulphoxide, a boronic acid, a boronic acid ester, an organotin compound, an iodonium ion, an iodonium salt, an iodonium ylide, and a sulphonate.

Abstract: A compound of general formula I Residues X1a, X1b, X2a, X2b, X3a, X3b, X4a, X4b, X5a, and X5b each independently are hydrogen or deuterium, with the provision that at least one of residues X1a, X1b, X2a, X2b, X3a, X3b, X4a, X4b, X5a, and X5b is deuterium.

Abstract: A method for the zonal polishing of a workpiece includes using a polishing tool to guide a structured polishing pad over the surface of workpiece to remove material from the workpiece. A structured polishing pad includes a structuring adapted to the movement of a polishing tool.

Abstract: The invention relates to a compound of formula Ia or Ib wherein R1 represents —CO2R3, —COR4 or —R5, wherein R3 represents unsubstituted or substituted C1-C6 alkyl, R4 represents hydrogen, unsubstituted or substituted C1-C6 alkyl, and R5 represents hydrogen, unsubstituted or substituted C1-C6 alkyl, R2 represents —N+(R6)(R7)(R8)X? or a nitro group, wherein R6, R7, R8 independently of each other represent unsubstituted or substituted C1-C6 alkyl or unsubstituted or substituted —(CH2)n- with n=1 to 12 provided that at least two of the substituents R6R7R8 are C1-C6 alkyl, and X? represents a halide, sulphonate, unsubstituted or substituted acetate, sulphate, hydrogen sulphate, nitrate, perchlorate, or oxalate.

Abstract: The invention relates to a compound of formula Ia or Ib wherein R1 represents —CO2R3, —COR4 or —R5, wherein R3 represents unsubstituted or substituted C1-C6 alkyl, R4 represents hydrogen, unsubstituted or substituted C1-C6 alkyl, and R5 represents hydrogen, unsubstituted or substituted C1-C6 alkyl, R2 represents —N+(R6)(R7)(R8)X? or a nitro group, wherein R6, R7, R8 independently of each other represent unsubstituted or substituted C1-C6 alkyl or unsubstituted or substituted —(CH2)n- with n=1 to 12 provided that at least two of the substituents R6R7R8 are C1-C6 alkyl, and X? represents a halide, sulphonate, unsubstituted or substituted acetate, sulphate, hydrogen sulphate, nitrate, perchlorate, or oxalate

Abstract: A device for processing the finish of work pieces. The device has a feed unit with a slide and an NC-controlled drive, a motorized spindle unit with a motor-driven tool spindle, and a force measurement device. The force measurement device is for measuring the contact pressure that is brought to bear upon the tool spindle in the course of processing a work piece. According to the invention, the motorized spindle unit is seated on the slide with resilient elements that accept the weight of the motorized spindle unit and are movable only in the direction of processing. The slide is supported on leaf springs, which are oriented perpendicular to the direction of advance of the slide. The force measurement device is arranged on the motorized spindle unit and on the slide between the connective elements.

Abstract: A method for the finishing treatment of work pieces, uses a processing device including a tool spindle for a processing tool and a numerically controlled (NC) feeding device. The force of the contact pressure applied to the work piece on the side of the work piece is measured and the measured force values are supplied to the numerical control (NC), which determines and fixes the feed rate at which the processing tool is advanced against the work piece. The finishing treatment is carried out in a force-controlled operating mode, in which the feed rate is controlled depending on the force of the contact pressure acting on the processing tool. A processing device is employed whose tool spindle is movably supported in the direction of the feeding movement on leaf springs on the feeding device. The processing device includes a force-measuring device effective between the tool spindle and the feeding device and operating substantially free of deformation.

Abstract: A method for the finishing treatment of work pieces, uses a processing device including a tool spindle for a processing tool and a numerically controlled (NC) feeding device. The force of the contact pressure applied to the work piece on the side of the work piece is measured and the measured force values are supplied to the numerical control (NC), which determines and fixes the feed rate at which the processing tool is advanced against the work piece. The finishing treatment is carried out in a force-controlled operating mode, in which the feed rate is controlled depending on the force of the contact pressure acting on the processing tool. A processing device is employed whose tool spindle is movably supported in the direction of the feeding movement on leaf springs on the feeding device. The processing device includes a force-measuring device effective between the tool spindle and the feeding device and operating substantially free of deformation.

Abstract: A device for processing the finish of work pieces. The device has a feed unit with a slide and an NC-controlled drive, a motorized spindle unit with a motor-driven tool spindle, and a force measurement device. The force measurement device is for measuring the contact pressure that is brought to bear upon the tool spindle in the course of processing a work piece. According to the invention, the motorized spindle unit is seated on the slide with resilient elements that accept the weight of the motorized spindle unit and are movable only in the direction of processing. The slide is supported on leaf springs, which are oriented perpendicular to the direction of advance of the slide. The force measurement device is arranged on the motorized spindle unit and on the slide between the connective elements.