Abstract: An electronics housing for an auxiliary unit of a motor vehicle has a metal lead frame with at least one connection contact. The lead frame is encapsulated as an insert with a plastic material of a housing part. At least sections of the connection contact project out of the housing part. The connection contact is enclosed by a potting pocket formed integrally on the housing part. A hardened potting compound is filled into the potting pocket. The connection contact has a form-fit contour which creates a form-fit between the connection contact and the potting compound so that shear forces and/or tensile forces occurring during thermal expansion are reduced between the connection contact and the potting compound.