Abstract: A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

Abstract: A water-cooled electronic system includes a tank filled with an array of microelectronic modules spaced apart in the tank, creating water channels between the modules. A water conduit connects between the tank output and the tank input and includes a variable pump. The modules are cooled by water flowing in the channels, and a system controller implements a master control algorithm to maintain an optimal balance between single-phase and two-phase cooling, by controlling the output pressure of the variable pump in addition to monitoring and controlling local temperatures and pressures and throttling input power when necessary to meet pre-determined safety conditions.

Abstract: A hermetic microelectronic module includes a substrate having redistribution layers fabricated thereon, a plurality of electronic components mounted on the substrate to create an electronic assembly, and a sheath enclosing the electronic assembly except for an opening at the top for making electrical connections. The sheath may take several physical forms, and backside power distribution may be employed. 3D features may be employed on the sheath surface to increase the convective heat transfer coefficient. A computer server includes an array of hermetic microelectronic modules partially immersed in a tank of water.

Abstract: A microelectronic module includes a substrate having a plurality of mounted electronic components. The components are selected from bare die, chiplets, stacked devices, low-profile packaged devices, optical and electro-optical devices, and surface mount devices. A water-impermeable coating surrounds the microelectronic module except for an opening at the top for making input/output connections. A water-cooled server includes a plurality of the microelectronic modules disposed in a tank with cooling water flowing around the modules.

Abstract: A zettascale supercomputer may be configured using an array of servers organized in computer pods comprising 4-60 servers per pod. Each server includes computer modules immersed in a tank in which cooling water is flowing. Copper bus bars deliver power to each pod in a range of 4-180 MW. Cooling water is delivered to each pod in a range of 200-24,000 gallons per minute. Supercomputers having an operating power in a range of 4 MW-10 GW are described.

Abstract: A computer module includes a substrate having a plurality of electronic components flip-chip mounted on the first and second sides of the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the electronic components. A metallization surrounds the mounted electronic components, providing a sealed enclosure that is partially immersible in water. A water-cooled server is also disclosed that includes a plurality of the computer modules disposed in a tank with cooling water circulating around the modules.

Abstract: A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

Abstract: A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

Abstract: A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 ?m or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in3.

Abstract: A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 ?m or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in3.

Abstract: A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm2 and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components in a circuit assembly. Switchable chips and redundant switchable chips may be included on each circuit assembly. Each independently operable cluster of components may include a power distribution chip, a test/monitor chip, and at least one redundant chip for each different logic device and for each different memory device. Chiplet components and combinations may be used to populate independently operable clusters of components. Agile reconfigurable systems are operable to adapt to changing workloads under direction of a system controller.

Abstract: A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

Abstract: A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm2 and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components in a circuit assembly. Switchable chips and redundant switchable chips may be included on each circuit assembly. Each independently operable cluster of components may include a power distribution chip, a test/monitor chip, and at least one redundant chip for each different logic device and for each different memory device. Chiplet components and combinations may be used to populate independently operable clusters of components. Agile reconfigurable systems are operable to adapt to changing workloads under direction of a system controller.

Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.

Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.

Abstract: A charge storage cell includes a substrate having a back side conductive layer or conductive element, a top side metal pad coupled to the substrate, and an insulating layer formed on the metal pad. The metal pad will support an electric charge injected through the insulating layer by a charged particle beam. A regular array of charge storage cells provides a charge storage array.

Abstract: A charge storage cell includes a substrate having a back side conductive layer or conductive element, a top side metal pad coupled to the substrate, and an insulating layer formed on the metal pad. The metal pad will support an electric charge injected through the insulating layer by a charged particle beam. A regular array of charge storage cells provides a charge storage array.

Abstract: A charge storage cell includes a conductive substrate, a substantially vertical post comprising a first insulating material coupled to the conductive substrate and a conductive cap coupled to the vertical post. The charge storage cell also includes a top side planarizing layer comprising a second insulating material and covering the conductive cap. The conductive cap will support an electric charge injected through the top side planarizing layer by a modulated charged particle beam.

Abstract: A charge storage cell includes a conductive substrate, a substantially vertical post comprising a first insulating material coupled to the conductive substrate and a conductive cap coupled to the vertical post. The charge storage cell also includes a top side planarizing layer comprising a second insulating material and covering the conductive cap. The conductive cap will support an electric charge injected through the top side planarizing layer by a modulated charged particle beam.

Abstract: A device includes a processor and memory coupled to the processor. The memory is encoded with instructions that are executable by the processor to provide content signals. The device also includes a display screen extendable to present an extended portion comprising display pixels configured to display content using the content signals. The display screen comprises a scroll element which may provide a base substrate on which thin film circuits are fabricated, and may also provide motive force during retraction. The scroll element is attached to a pull bar and the pull bar is attached to an extensible support member that provides support during extension and retraction of the display screen.