Patents by Inventor Peter C. Schaefer

Peter C. Schaefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diamond substrates having metallized vias
    Patent number: 5382758
    Abstract: A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.
    Type: Grant
    Filed: January 31, 1994
    Date of Patent: January 17, 1995
    Assignee: General Electric Company
    Inventors: Charles D. Iacovangelo, Elihu C. Jerabek, Ronald H. Wilson, Peter C. Schaefer
  • Process for making metallized vias in diamond substrates
    Patent number: 5328715
    Abstract: A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.
    Type: Grant
    Filed: February 11, 1993
    Date of Patent: July 12, 1994
    Assignee: General Electric Company
    Inventors: Charles D. Iacovangelo, Elihu C. Jerabek, Ronald H. Wilson, Peter C. Schaefer