Abstract: A filter circuitry (200) using an active inductor is disclosed. The filter circuitry (200) has a first terminal (In1/Out1) and a second terminal (In2/Out2). The filter circuitry (200) comprises a first transistor (M1) and a second transistor (M2). The filter circuitry (200) further comprises a first switch (S1), a second switch (S2), a first capacitor (C1), a second capacitor (C2) and a resistor (R). The first and second transistors (M1/M2) together with the resistor (R) and the first and second switches (S1/S2) are connected in a current mirror topology. The first and second capacitors (C1/C2) are connected at the first and second terminals of the filter circuitry (200) respectively. The filter circuitry (200) is configurable to either have the first terminal (In1/Out1) as input and the second terminal (In2/Out2) as output or have the first terminal (In1/Out1) as output and the second terminal (In2/Out2) as input by changing on-off states of the first and second switches.

Abstract: A tank circuit (200) includes a tunable resonator subcircuit (210) having a first control input and having an effective parallel resistance that varies with tuning of the tunable resonator subcircuit (210). The tank circuit (200) further comprises a variable negative-resistance subcircuit (250) having a second control input and coupled in parallel to the tunable resonator subcircuit (210), where the variable negative-resistance subcircuit (250) is configured to provide a variable negative resistance, responsive to the control input, so as to increase the effective parallel resistance of the tank circuit (200).

Abstract: A method of producing a complex shape in a workpiece includes the steps of: i) grinding a workpiece at a maximum specific cutting energy of about 10 Hp/in3·min with at least one bonded abrasive tool, thereby forming a slot in the workpiece; and ii) grinding the slot with at least one mounted point tool, thereby producing the complex shape in the slot. The bonded abrasive tool includes at least about 3 volume % of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1 or an agglomerate thereof. A method of producing a slot in a metallic workpiece having a maximum hardness value of equal to, or less than, about 65 Rc includes the step of grinding the workpiece with a bonded abrasive tool at a material removal rate in a range of between about 0.25 in3/min·in and about 60 in3/min·in and at a maximum specific cutting energy of about 10 Hp/in3·min.

Abstract: A method of producing a complex shape in a workpiece includes the steps of: i) grinding a workpiece at a maximum specific cutting energy of about 10 Hp/in3·min with at least one bonded abrasive tool, thereby forming a slot in the workpiece; and ii) grinding the slot with at least one mounted point tool, thereby producing the complex shape in the slot. The bonded abrasive tool includes at least about 3 volume % of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1 or an agglomerate thereof. A method of producing a slot in a metallic workpiece having a maximum hardness value of equal to, or less than, about 65 Rc includes the step of grinding the workpiece with a bonded abrasive tool at a material removal rate in a range of between about 0.25 in3/min·in and about 60 in3/min·in and at a maximum specific cutting energy of about 10 Hp/in3·min.

Abstract: According to some embodiments, provided are a static low-swing driver circuit to receive a full-swing input signal, to convert the full-swing input signal to a low-swing signal, and to transmit the low-swing signal, and a dynamic receiver circuit to receive the low-swing signal and to convert the low-swing signal to a full-swing signal. Also provided may be an interconnect coupled to the driver circuit and to the receiver circuit, the interconnect not comprising a repeater and to receive the low-swing signal from the driver circuit and to transmit the low-swing signal to the receiver circuit.

Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.

Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.

Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.

Abstract: An interconnect architecture is provided to reduce power consumption. A first driver may drive signals on a first interconnect and a second driver may drive signals on a second interconnect. The first driver may be powered by a first voltage and the second driver may be powered by a second voltage different than the first voltage.

Abstract: According to some embodiments, provided are a static low-swing driver circuit to receive a full-swing input signal, to convert the full-swing input signal to a low-swing signal, and to transmit the low-swing signal, and a dynamic receiver circuit to receive the low-swing signal and to convert the low-swing signal to a full-swing signal. Also provided may be an interconnect coupled to the driver circuit and to the receiver circuit, the interconnect not comprising a repeater and to receive the low-swing signal from the driver circuit and to transmit the low-swing signal to the receiver circuit.