Abstract: An antenna system is provided that includes at least one driven radiator element and at least one coupling device. The at least one driven radiator element is disposed above a printed circuit board. The at least one coupling device has a step feature in at least one of width and diameter. A smaller of the at least one of the width and diameter is received in at least one of a via and slot in the printed circuit board. The at least one coupling device is oriented nominally orthogonal to a plane of the printed circuit board. The at least one solder joint couples the at least one coupling device to the printed circuit board. At least one ground plane layer is electrically connected to the at least one coupling device by at least one of the solder joint and the at least one of a via and a slot.

Abstract: An antenna system is provided that includes at least one driven radiator element and at least one coupling device. The at least one driven radiator element is disposed above a printed circuit board. The at least one coupling device has a step feature in at least one of width and diameter. A smaller of the at least one of the width and diameter is received in at least one of a via and slot in the printed circuit board. The at least one coupling device is oriented nominally orthogonal to a plane of the printed circuit board. The at least one solder joint couples the at least one coupling device to the printed circuit board. At least one ground plane layer is electrically connected to the at least one coupling device by at least one of the solder joint and the at least one of a via and a slot.

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

Abstract: The present invention provides a high-performance helical antenna element and array thereof for use in an aircraft communication system or the like, where stringent spatial restrictions and gain requirements generally apply. The performance of the array is enhanced by connecting conductive plates to the windings of the antenna elements at the terminal ends thereof such that the conductive plates are offset from the axes of the antenna elements and toward the center of the array.

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.