Patents by Inventor Peter Comley

Peter Comley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090026246
    Abstract: A method of superplastic forming of titanium packs and an associated assembly is provided. The titanium packs can include sheets having different granular structures so that the different sheets are adapted to superplastically form at different temperatures. One or more of the sheets can be formed at a temperature that is below the superplastic forming temperature of another sheet in the pack. In some cases, the occurrence of markoff can be reduced or eliminated.
    Type: Application
    Filed: November 10, 2005
    Publication date: January 29, 2009
    Inventors: Thomas Connelly, Kent Dunstan, William Williams, Peter Comley, Larry Hefti
  • Publication number: 20070102494
    Abstract: A method of superplastic forming of titanium packs and an associated assembly is provided. The titanium packs can include sheets having different granular structures so that the different sheets are adapted to superplastically form at different temperatures. One or more of the sheets can be formed at a temperature that is below the superplastic forming temperature of another sheet in the pack. In some cases, the occurrence of markoff can be reduced or eliminated.
    Type: Application
    Filed: November 10, 2005
    Publication date: May 10, 2007
    Inventors: Thomas Connelly, Kent Dunstan, William Williams, Peter Comley, Larry Hefti
  • Publication number: 20050218193
    Abstract: A method for superplastically forming and/or diffusion bonding a structural member and an associated structural member are provided. The structural member is formed at least partially of titanium, e.g., Ti-6Al-4V, and has a fine grain structure. For example, the grain size of the material of the structural member can be less than 2 micron. The member can be superplastically formed and/or diffusion bonded at a reduced temperature, thereby potentially reducing the thermal energy required for forming and bonding, and also reducing the effects of heating on the structural member and the forming apparatus. In addition, the structural member can be formed at an increased strain rate.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Peter Comley, Larry Hefti