Abstract: A solder paste inspection machine carries out the steps of automatically generating inspection data for solder paste deposits, automatically determining a squeegee direction of travel for said paste deposits. It associates the squeegee direction with the inspection data, and feeds the inspection data back to a solder paste printer with an indication of squeegee direction. The direction is determined from three-dimensional range maps, the direction of squeegee travel being in the direction of upward slope.

Abstract: A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).

Abstract: Determining the quality of a solder paste deposit includes comparing the fluorescence from a solder paste deposit with that of a deposit having an ideal mixture of flux and metal spheres.

Abstract: An illumination head (1) for machine vision has an annular support (2) with first, second, third, and fourth illumination sections (3, 4, 5, and 6). The third section (5) has three sets of LEDs (12, 13, 14) arranged in a pattern so that each set illuminates at approximately the same angle. Each set is driven in succession so that a series of three monochrome images at the same angle are captured. These are superimposed by an image processor to provide a color image, although the camera is monochrome. More information can be obtained in such a color image and the high resolution and robustness of monochrome cameras is availed of.

Abstract: A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).

Abstract: Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput.

Abstract: An inspection station (6) has a ring of 370 nm LEDs (24) for low-angle diffuse illumination of flux. This stimulates inherent fluorescent emission of the flux without the need for flux additives or pre-treatment. A CCD sensor (20) detects the emission. An image processor generates output data indicating flux volume according to a relationship between emission intensity and volume over the surface of the flux. Intensity non-uniformity indicates either height non-uniformity or hidden voids, both of which give rise to defects after application of solder paste and reflow. The inspection is particularly effective for pre solder application flux inspection.

Abstract: A system has a projection lens directing on-axis light and low level LEDs directing light to blind microvias. A high resolution camera captures blind microvia images and an image processor recognizes defects according to classifications according to reflected light area and centroid position. The lens is telecentric for particularly effective image capture in blind microvias. The system also has an array of 6000 back lighting LEDs providing illumination for capture of images by a camera. These images are analyzed by the image processor to detect defects such as blocked through microvias.

Abstract: Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput.

Abstract: A measurement system (1) has a camera with a lens (12) and a separate sensor (10) mounted so that their planes (13,11) intersect at an object plane (3) according to the Scheimpflug principle. A reference camera(4) is normal and provides a 2D normal image which is used by an image processor (25) to determine a calibration image. This allows the image processor to determine height of the object (2). A single image capture provides an image of the full object, such as a ball grid array (BGA).

Abstract: An illumination head (1) for machine vision has an annular support (2) with first, second, third, and fourth illumination sections (3, 4, 5, and 6). The third section (5) has three sets of LEDs (12, 13, 14) arranged in a pattern so that each set illuminates at approximately the same angle. Each set is driven in succession so that a series of three monochrome images at the same angle are captured. These are superimposed by an image processor to provide a color image, although the camera is monochrome. More information can be obtained in such a color image and the high resolution and robustness of monochrome cameras is availed of.

Abstract: An inspection station (6) has a ring of 370 nm LEDs (24) for low-angle diffuse illumination of flux. This stimulates inherent fluorescent emission of the flux without the need for flux additives or pre-treatment. A CCD sensor (20) detects the emission. An image processor generates output data indicating flux volume according to a relationship between emission intensity and volume over the surface of the flux. Intensity non-uniformity indicates either height non-uniformity or hidden voids, both of which give rise to defects after application of solder paste and reflow. The inspection is particularly effective for pre solder application flux inspection.

Abstract: A system (1) has a projection lens (12) directing on-axis light and low level LEDs (18) directing light to blind microvias (5). A high resolution camera (14) captures blind microvia images and an image processor recognizes defects according to classifications (54-59) according to reflected light area and centroid position. The lens (12) is telecentric for particularly effective image capture in blind microvias (5). The system also has an array of 6000 back lighting LEDs (10) providing illumination for capture of images by a camera (15). These images are analyzed by the image processor to detect defects such as blocked through microvias.

Abstract: A measurement system (1) has robotic system (3) mounted over a base plate (2) which provides a vertical height reference. In the optical head (8), a CCD camera (17) is adjustable to be pre-set in height. The optical head (8) also has an upper light source (18) comprising LEDs and a lower light source (25) comprising a white fluorescent lamp (26) for lateral component illumination. An air flow system (45) directs cooling air in a swirling motion around the tube. An image analysis computer (10) automatically performs various tests to co-ordinate optical and mechanical operation.

Abstract: A mechanical apparatus for flashing a hookswitch of a telephone set. The apparatus is comprised of a baseplate for retention on a telephone set, and first and second co-operative planar members resiliently hinged to an edge of the baseplate, whereby the second member depresses the hookswitch in response to the first member being depressed a first predetermined amount, and subsequently releases the hookswitch in response to the first member being further depressed. The apparatus provides an accurately timed hookswitch flash in response to simple mechanical co-operation between the first and second members. The apparatus is easily installed, does not require specially modified circuitry and is highly reliable as a result of its simple construction.