Patents by Inventor Peter D. Brewer

Peter D. Brewer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12278212
    Abstract: An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 15, 2025
    Assignee: The Boeing Company
    Inventors: Peter D. Brewer, John J. Vajo, Sevag Terterian, Chia-Ming Chang, Charbel Abijaoude, Diego Eduardo Carrasco
  • Patent number: 12216140
    Abstract: A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: February 4, 2025
    Assignee: The Boeing Company
    Inventors: Peter D. Brewer, Chia-Ming Chang, Sevag Terterian, Charbel Abijaoude, Diego Eduardo Carrasco
  • Publication number: 20250007195
    Abstract: A reversible attachment micro connector includes a pin and mounted on a first assembly and a socket mounted on a second assembly. The socket is operational to mate with the pin at least two times to establish an electrical connection, and separate from the pin at least once. The socket includes a surround structure that defines a cavity with a floor. The cavity is sized to receive the pin. Multiple tabs are disposed in the cavity and coupled to the surround structure. The tabs have a negative longitudinal curvature that protrudes into the cavity. The tabs bend in three dimensions during insertion of the pin and removal of the pin. The negative longitudinal curvature generates a stress distribution that is uniform between the pin and the tabs while the pin is seated in the socket. The pin is retained in the socket based on the stress distribution.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 2, 2025
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, Chia-Ming Chang, Diego Eduardo Carrasco, Sevag Terterian, Charbel Abijaoude
  • Patent number: 12040311
    Abstract: A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: July 16, 2024
    Assignee: The Boeing Company
    Inventors: Peter D. Brewer, Chia-Ming Chang, Sevag Terterian, Charbel Abijaoude, Diego Eduardo Carrasco
  • Publication number: 20240213214
    Abstract: A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 27, 2024
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, Chia-Ming Chang, Sevag Terterian, Charbel Abijaoude, Diego Eduardo Carrasco
  • Publication number: 20240213212
    Abstract: A reversable attachment system includes an adhesion layer, an inter-substrate bond structure, a mating layer and an extension actuator. The adhesion layer is configured to attach to a first substrate. The inter-substrate bond structure is coupled to the adhesion layer. The mating layer is configured to attach to a second substrate. The extension actuator is configured to attach to the second substrate and expand in response to an absorption of a gas. The inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat. The expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.
    Type: Application
    Filed: December 23, 2022
    Publication date: June 27, 2024
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, Yan Tang, Chia-Ming Chang, Sevag Terterian, Charbel Abijaoude, John J. Vajo
  • Publication number: 20240125817
    Abstract: A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.
    Type: Application
    Filed: October 17, 2022
    Publication date: April 18, 2024
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, Chia-Ming Chang, Sevag Terterian, Charbel Abijaoude, Diego Eduardo Carrasco
  • Publication number: 20230378126
    Abstract: An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, John J. Vajo, Sevag Terterian, Chia-Ming Chang, Charbel Abijaoude, Diego Eduardo Carrasco
  • Publication number: 20230377929
    Abstract: A method to align targets on opposite sides of a substrate includes forming a first via pattern in a protective layer on a first side of the substrate. The substrate includes a second side opposite the first side. The first via pattern is a first pixelated version of a first alignment target. The first alignment target is optically recognizable by an automated alignment system. The method includes etching a plurality of first vias through the substrate to the second side in the first via pattern. The first via pattern is optically recognizable by the automated alignment system as the first alignment target on both the first side and the second side of the substrate.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, Sevag Terterian, Diego Eduardo Carrasco, Charbel Abijaoude
  • Publication number: 20230378120
    Abstract: A method to aid in a calibration of a compression system includes mounting a first substrate in a press. The press has calibration parameters, and the first substrate has a test film on a first surface. The method includes mounting a second substrate in the press. The second substrate has spikes arranged in a spike pattern on a second surface. The method includes compressing the first substrate and the second substrate together with a force that causes the spikes to form indentations in the test film, separating the first substrate from the second substrate, determining local pressures applied by the spikes against the test film, and adjusting one or more calibration parameters of the press in response to the local pressures.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Applicant: The Boeing Company
    Inventors: Peter D. Brewer, Chia-Ming Chang, Partia Naghibi Mahmoudabadi, Sevag Terterian, Diego Eduardo Carrasco, Charbel Abijaoude
  • Patent number: 9951232
    Abstract: The present disclosure relates to solution processed nanomaterials, and methods for their manufacture, with activity in the infrared (IR) region for a variety of commercial and defense applications, including conformal large-area IR coatings, devices and pigments that necessitate an absorption band edge in the MWIR or LWIR.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: April 24, 2018
    Assignee: THE BOEING COMPANY
    Inventors: Larken E. Euliss, Brett Nosho, Nicole L. Abueg, G. Michael Granger, Peter D. Brewer, Maryam Behroozi
  • Patent number: 9536844
    Abstract: The disclosed antenna structures and electronic microsystems are capable of physically disappearing in a controlled, triggerable manner. Some variations provide an on-chip transient antenna comprising a semiconductor substrate containing ion-implanted hydrogen atoms and a conductor network comprising metals bridged by low-melting-temperature metals. Some variations provide an off-chip transient antenna comprising a flexible substrate containing a polymer, nanoporous silicon particles, and an oxidant for silicon, and a conductor network comprising metals bridged by low-melting-temperature metals. Other variations provide a method of introducing physical transience to a semiconductor integrated circuit, comprising thinning a substrate from the back side, implanting hydrogen ions into the thinned substrate to introduce latent structural flaws, depositing a semiconductor integrated circuit or sensor chip, and providing a controllable heating source capable of activating the latent structural flaws.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: January 3, 2017
    Assignee: HRL Laboratories, LLC
    Inventors: Peter D. Brewer, Dana C. Wheeler, Tahir Hussain, Kyung-Ah Son, Hyok J. Song, Harris P. Moyer, Joseph S. Colburn, James H. Schaffner
  • Patent number: 9524872
    Abstract: A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: December 20, 2016
    Assignee: HRL Laboratories, LLC
    Inventors: Peter D. Brewer, Andrew T. Hunter, Yakov Royter
  • Patent number: 9405192
    Abstract: A method for fabricating a radiation-cured structure is provided. The method includes the steps of providing a first radiation-sensitive material and a second radiation-sensitive material adjacent the first radiation-sensitive material. The first radiation-sensitive material has a first sensitivity. The second radiation-sensitive material has the first sensitivity and a second sensitivity different from the first sensitivity. At least one mask is placed between at least one radiation source and the first and second radiation-sensitive materials. The mask has a plurality of substantially radiation-transparent apertures. The first and second radiation-sensitive materials are then exposed to a plurality of radiation beams through the radiation-transparent apertures in the mask to form a first construct in the first radiation-sensitive material and a second construct in the second radiation-sensitive material. The first construct and the second construct cooperate to form the radiation-cured structure.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: August 2, 2016
    Assignee: GM Global Technology Operations LLC
    Inventors: Jeffrey A. Rock, Gerald W. Fly, Yeh-Hung Lai, Keith E. Newman, Alan J. Jacobsen, William B. Carter, Peter D. Brewer, Hung D. Nguyen, Joanna A. Kolodziejska
  • Patent number: 9318631
    Abstract: A method for manufacturing a photodiode including the steps of providing a substrate, solution depositing a quantum nanomaterial layer onto the substrate, the quantum nanomaterial layer including a number of quantum nanomaterials having a ligand coating, and applying a thin-film oxide layer over the quantum nanomaterial layer.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: April 19, 2016
    Assignee: The Boeing Company
    Inventors: Larken E. Euliss, G. Michael Granger, Keith J. Davis, Nicole L. Abueg, Peter D. Brewer, Brett Nosho
  • Patent number: 9256132
    Abstract: A method for fabricating a radiation-cured structure is provided. The method includes the steps of providing a first radiation-sensitive material and applying a second radiation-sensitive material to the first radiation-sensitive material. The first radiation-sensitive material has a first sensitivity. The second radiation-sensitive material has a second sensitivity different from the first sensitivity. At least one mask is placed between at least one radiation source and the first and second radiation-sensitive materials. The mask has a plurality of substantially radiation-transparent apertures. The first and second radiation-sensitive materials are then exposed to a plurality of radiation beams through the radiation-transparent apertures in the mask to form a first construct in the first radiation-sensitive material and a second construct in the second radiation-sensitive material. The first construct and the second construct cooperate to form the radiation-cured structure.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: February 9, 2016
    Assignee: GM Global Technology Operations LLC
    Inventors: Jeffrey A. Rock, Gerald W. Fly, Yeh-Hung Lai, Keith E. Newman, Alan J. Jacobsen, William B. Carter, Peter D. Brewer
  • Publication number: 20150225575
    Abstract: The present disclosure relates to solution processed nanomaterials, and methods for their manufacture, with activity in the infrared (IR) region for a variety of commercial and defense applications, including conformal large-area IR coatings, devices and pigments that necessitate an absorption band edge in the MWIR or LWIR.
    Type: Application
    Filed: April 21, 2015
    Publication date: August 13, 2015
    Inventors: Larken E. Euliss, Brett Nosho, Nicole L. Abueg, G. Michael Granger, Peter D. Brewer, Maryam Behroozi
  • Publication number: 20150122327
    Abstract: A method for manufacturing a photodiode including the steps of providing a substrate, solution depositing a quantum nanomaterial layer onto the substrate, the quantum nanomaterial layer including a number of quantum nanomaterials having a ligand coating, and applying a thin-film oxide layer over the quantum nanomaterial layer.
    Type: Application
    Filed: January 13, 2015
    Publication date: May 7, 2015
    Inventors: Larken E. Euliss, G. Michael Granger, Keith J. Davis, Nicole L. Abueg, Peter D. Brewer, Brett Nosho
  • Patent number: 9005847
    Abstract: A method for fabricating a fuel cell component includes the steps of providing a mask having a plurality of radiation transparent apertures, a radiation-sensitive material having a sensitivity to the plurality of radiation beams, and a flow field layer. The radiation-sensitive material is disposed on the flow field layer. The radiation-sensitive material is then exposed to the plurality of radiation beams through the radiation transparent apertures in the mask to form a diffusion medium layer with a micro-truss structure.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: April 14, 2015
    Assignees: GM Global Technology Operations LLC, HRL Laboratories, LLC
    Inventors: Jeffrey A. Rock, Yeh-Hung Lai, Keith E. Newman, Gerald W. Fly, Ping Liu, Alan J. Jacobsen, William B. Carter, Peter D. Brewer
  • Publication number: 20150055114
    Abstract: A method for fabricating a radiation-cured structure is provided. The method includes the steps of providing a first radiation-sensitive material and applying a second radiation-sensitive material to the first radiation-sensitive material. The first radiation-sensitive material has a first sensitivity. The second radiation-sensitive material has a second sensitivity different from the first sensitivity. At least one mask is placed between at least one radiation source and the first and second radiation-sensitive materials. The mask has a plurality of substantially radiation-transparent apertures. The first and second radiation-sensitive materials are then exposed to a plurality of radiation beams through the radiation-transparent apertures in the mask to form a first construct in the first radiation-sensitive material and a second construct in the second radiation-sensitive material. The first construct and the second construct cooperate to form the radiation-cured structure.
    Type: Application
    Filed: November 4, 2014
    Publication date: February 26, 2015
    Inventors: Jeffrey A. Rock, Gerald W. Fly, Yeh-Hung Lai, Keith E. Newman, Alan J. Jacobsen, William B. Carter, Peter D. Brewer