Abstract: A multilayer pressure sensitive correction tape useful for masking handwritten and/or printed characters comprising a release liner, a masking layer and a pressure sensitive adhesive layer, wherein at least one of the layers is cured by radiation. In a preferred embodiment of the invention, the masking layer and pressure sensitive adhesive layer comprise formulations of reactive monomers or oligomers which are radiation-cured after the formulations are applied to the correction tape assembly. In a more preferred embodiment of the invention the masking layer and pressure sensitive adhesive layer formulations contain no volatile solvents when these formulations are applied to the correction tape assembly. The radiation-cured layers are essentially insoluble in organic solvents and water, and the radiation-cured layers exhibit improved film toughness and improved resistance to ink “bleed through”.

Abstract: A double-faced, non-woven supported silicone pressure sensitive adhesive splicing tape comprising a non-woven backing material having opposing porous surfaces, each said surfaces being coated with a pressure sensitive adhesive, with at least one of said surfaces being coated with a silicone pressure sensitive adhesive layer which is coated and cured on said surface. A method of using the double-faced, non-woven supported silicone pressure sensitive adhesive splicing tape to splice substrates having a low energy surface is also provided.

Abstract: A multilayer pressure sensitive correction tape useful for masking handwritten and/or printed characters comprising a release liner, a masking layer and a pressure sensitive adhesive layer, wherein at least one of the layers is cured by radiation. In a preferred embodiment of the invention, the masking layer and pressure sensitive adhesive layer comprise formulations of reactive monomers or oligomers which are radiation-cured after the formulations are applied to the correction tape assembly. In a more preferred embodiment of the invention the masking layer and pressure sensitive adhesive layer formulations contain no volatile solvents when these formulations are applied to the correction tape assembly. The radiation-cured layers are essentially insoluble in organic solvents and water, and the radiation-cured layers exhibit improved film toughness and improved resistance to ink “bleed through”.

Abstract: The present invention is directed to correction tapes having dye migration blocking properties. More specifically, the present invention includes a correction tape having a dye migration barrier. The dye migration barrier comprises an organic material that serves as a physical barrier to prevent dye from migrating from the lower corrected layer to the visible surface. Additionally, the present invention is directed to a process for the manufacture of a correction tape having a dye migration barrier.

Abstract: A photosensitive composition for providing a solder mask on a printed circuit board is described, comprised of (a) an esterified styrene-maleic anhydride copolymer having less than 15%, most preferably less than 5%, free anhydride, with at least about 50% of the available anhydride groups being esterified with a hydroxyalkyl (meth)acrylate and at least about 0.1% of the available anhydride groups being esterified with a monohydric alcohol; (b) a multifunctional (meth)acrylate monomer; and (c) a multifunctional epoxide. The composition is coated on a printed circuit board, imagewise exposed to radiation to effect sufficient curing of the composition at exposed areas to enable removal of unexposed areas with developer, and post-baked after development to produce a desired patterned distribution of the cured composition to serve as a solder mask.

Abstract: Fungicides and fungicidal formulations are stabilized against the adverse effects of exposure to light by the addition thereto of effective amounts of a 2,2,6,6-tetraalkylpiperidine compound, or a UV absorber, or a blend of said piperidine compound and said UV absorber.