Abstract: A computer-implemented method for deploying a build output package to a user includes: receiving a software build having a plurality of data sets and having a build version in a build output storage component; labeling each data set in the plurality of data sets with a unique identifier; receiving a package request requesting one or more data sets associated with the build version; building a package manifest that includes the unique identifier upon receiving the package request; copying each of the requested data sets and combining each of the copied data sets into a build output package based upon the package manifest, the copying and combining commencing upon building or completion of the package manifest; sending a copy of the build output package to the user; and deleting the build output package from the storage component in response to sending the copy of the build output package to the user.

Abstract: Embodiments of the present invention provide a method, system and computer program product for extensible definition of interactive system productivity facility (ISPF) panels. In an embodiment of the invention, a method for extensibly defining ISPF panels can include loading a panel defined by different panel definition statements recognizable by an ISPF facility, and identifying a panel input exit facility amongst the panel definition statements defining the panel. Of note, the panel input exit facility references an external exit module. The method also can include determining an external exit module referenced by the panel input exit facility. Finally, the method includes passing records of the panel to the external input exit facility for pre-processing of the panel outside of the ISPF facility.

Abstract: A method includes receiving a message in a JavaScript object notation (JSON) format from a first processor, converting the message from the JSON format into a hypertext markup language (HTML) format, and presenting the content of the message in the HTML format to a user on a display.

Abstract: A method includes receiving a message in a JavaScript object notation (JSON) format from a first processor, converting the message from the JSON format into a hypertext markup language (HTML) format, and presenting the content of the message in the HTML format to a user on a display.

Abstract: Embodiments of the present invention provide a method, system and computer program product for extensible definition of interactive system productivity facility (ISPF) panels. In an embodiment of the invention, a method for extensibly defining ISPF panels can include loading a panel defined by different panel definition statements recognizable by an ISPF facility, and identifying a panel input exit facility amongst the panel definition statements defining the panel. Of note, the panel input exit facility references an external exit module. The method also can include determining an external exit module referenced by the panel input exit facility. Finally, the method includes passing records of the panel to the external input exit facility for pre-processing of the panel outside of the ISPF facility.

Abstract: A multilayer ceramic semiconductor chip carrier is provided by a method of interconnecting ground, signal and power lines in a semiconductor chip carrier. The method involves forming a plurality of insulating layers with conductor lines comprising power and ground lines connected in parallel in a single plane formed in planes between the insulating layers. The parallel lines are directed in orthogonal directions in parallel between any two of the insulating layers with alternation successively between planes of X-directed lines and planes of Y-directed coplanar signal, power and ground lines. There are via connections formed between planes connecting a power line in one plane to another power line in another plane. Other via connections between planes connect a ground line in a first plane to another ground line in a second plane, and signal lines are formed in parallel between a ground line and a power line in a given plane.

Abstract: A multilayer ceramic semiconductor chip carrier is provided by a method of interconnecting ground, signal and power lines in a semiconductor chip carrier. The method involves forming a plurality of insulating layers with conductor lines comprising power and ground lines connected in parallel in a single plane formed in planes between the insulating layers. The parallel lines are directed in orthogonal directions in parallel between any two of the insulating layers with alternation successively between planes of X-directed lines and planes of Y-directed coplanar signal, power and ground lines. There are via connections formed between planes connecting a power line in one plane to another power line in another plane. Other via connections between planes connect a ground line in a first plane to another ground line in a second plane, and signal lines are formed in parallel between a ground line and a power line in a given plane.