Abstract: There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf 130. The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.

Abstract: A stator for an electric machine of a motor vehicle includes with a laminated core in which at least one cooling channel runs, through which a cooling fluid for cooling the stator can flow, and at least one winding which is held on the laminated core and has a winding head. At least one ring is provided which adjoins a laminated core at least partially in the axial direction of the stator, has at least one guide channel which is connected fluidically to the cooling channel and through which the cooling fluid from the cooling channel can flow as a result, which guide channel has at least one outlet opening which is directed towards the winding head and via which the cooling fluid which flows through the cooling channel can be discharged from the ring and can be sprayed against the winding head.

Abstract: There may be provided a connector for a liquid container. The connector may include a connector body, and a through-hole for fitting on a neck portion of the liquid container. The connector may further include a restraining arrangement positioned proximal to the through-hole. The restraining arrangement may include a first restraining member and a second restraining member extending towards a central axis of the connector body. The first restraining member may have a distal end that extends further than a distal end of the second restraining member. The distal end of the first restraining member may engage the neck portion of the liquid container at a first position, and the distal end of the second restraining member may engage the neck portion of the liquid container at a second position. The connector may further include a connector-to-key-interface arrangement configured to mate with a corresponding surface of a key member.

Abstract: There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf 130. The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.

Abstract: There may be provided a connector for a liquid container. The connector may include a connector body, and a through-hole for fitting on a neck portion of the liquid container. The connector may further include a restraining arrangement positioned proximal to the through-hole. The restraining arrangement may include a first restraining member and a second restraining member extending towards a central axis of the connector body. The first restraining member may have a distal end that extends further than a distal end of the second restraining member. The distal end of the first restraining member may engage the neck portion of the liquid container at a first position, and the distal end of the second restraining member may engage the neck portion of the liquid container at a second position. The connector may further include a connector-to-key-interface arrangement configured to mate with a corresponding surface of a key member.

Abstract: An internal combustion engine has an exhaust gas recirculation system for recirculating exhaust gases from the internal combustion engine into an intake region of the internal combustion engine. The exhaust gas recirculation system includes the following components: at least one exhaust gas cooler through which a first flow path for recirculating exhaust gas extends, having at least one first cooling stage and at least one additional cooling stage, at least one flap arrangement by which the at least one additional cooling stage can be connected, a bypass line through which a second flow path for recirculating exhaust gas extends and by which the exhaust gas cooler can be bypassed during the recirculation of exhaust gas, and an EGR valve having at least three possible positions.

Abstract: A gas turbine engine including a rotor and a cooling fluid delivery system is presented. The rotor includes a disc and a plurality of blades extending radially therefrom. Each blade has a suction side and a pressure side and includes a shank, a platform and a main portion, the main portion being radially outward of the shank and separated therefrom by the platform. At least one cavity is defined, each radially inward of the platforms and between a suction side of the shank of one blade and a pressure side of the shank of an adjacent blade. The rotor includes at least one damper, the damper including a main body in contact with at least one blade and a deflector nose. The deflector nose extends from the main body into the cavity.

Abstract: An internal combustion engine has an exhaust gas recirculation system for recirculating exhaust gases from the internal combustion engine into an intake region of the internal combustion engine. The exhaust gas recirculation system includes the following components: at least one exhaust gas cooler through which a first flow path for recirculating exhaust gas extends, having at least one first cooling stage and at least one additional cooling stage, at least one flap arrangement by which the at least one additional cooling stage can be connected, a bypass line through which a second flow path for recirculating exhaust gas extends and by which the exhaust gas cooler can be bypassed during the recirculation of exhaust gas, and an EGR valve having at least three possible positions.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

Abstract: A gas turbine engine including a rotor and a cooling fluid delivery system is presented. The rotor includes a disc and a plurality of blades extending radially therefrom. Each blade has a suction side and a pressure side and includes a shank, a platform and a main portion, the main portion being radially outward of the shank and separated therefrom by the platform. At least one cavity is defined, each radially inward of the platforms and between a suction side of the shank of one blade and a pressure side of the shank of an adjacent blade. The rotor includes at least one damper, the damper including a main body in contact with at least one blade and a deflector nose. The deflector nose extends from the main body into the cavity.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Abstract: A method of launching a powered unmanned aerial vehicle at an altitude of at least 13,000 m, the method comprising lifting the vehicle by attachment to a lighter-than-air carrier from a substantially ground-level location to an elevated altitude, causing the vehicle to detach from the carrier while the velocity of the vehicle relative to the carrier is substantially zero, the vehicle thereafter decreasing in altitude as it accelerates to a velocity where it is capable of preventing any further descent and can begin independent sustained flight.

Abstract: Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

Abstract: A gas-turbine blade has a root 5 and an airfoil 2, with the airfoil 2 including an internal load carrier 6 as well as an airfoil element 8 enclosing the internal load carrier 6 by forming a cavity 7 extending along the longitudinal blade axis. The load carrier 6 is designed as a central element without cooling ducts and cooling air is introduced into the cavity 7 via the root 5.

Abstract: Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.

Abstract: Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Abstract: The present invention describes a method including: opening a door of a shell, the shell enclosing a stack of full-contact rings; determining a full-contact ring within the stack to engage; opening split ends of the full-contact ring to release a large wafer; lowering the large wafer from the full-contact ring; closing the split ends of the full-contact ring; extracting the large wafer from the shell; and closing the door of the shell.