Patents by Inventor Peter Demmer

Peter Demmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board with flexible region and method for production thereof
    Patent number: 9035189
    Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: May 19, 2015
    Assignee: EPCOS AC
    Inventors: Wolfgang Pahl, Hans Krueger, Peter Demmer
  • Circuit Board with Flexible Region and Method for Production Thereof
    Publication number: 20110214905
    Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
    Type: Application
    Filed: June 8, 2009
    Publication date: September 8, 2011
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Hans Krueger, Peter Demmer
  • Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves
    Patent number: 6722030
    Abstract: A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: April 20, 2004
    Assignee: EPCOS AG
    Inventors: Alois Stelzl, Hans Krueger, Peter Demmer
  • Sensor array for a capacitance measuring fingerprint sensor, and method for producing such a sensor array
    Patent number: 6481294
    Abstract: A base layer, which is preferably flexible, has first conductor tracks, a first insulation layer, fine structures with first electrodes, second conductor tracks and second electrodes, and finally a second insulation layer applied to it in succession. The first electrodes are connected, via plated-through holes, to associated first conductor tracks. Changes, caused by lines in the skin of a finger pad, in the stray capacitance between adjacent first and second electrodes are evaluated for recording fingerprints.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: November 19, 2002
    Assignee: Infineon Technologies AG
    Inventors: Maximilian Zellner, Jörg Zapf, Peter Demmer
  • Sensor array for a capacitance measuring fingerprint sensor, and method for producing such a sensor array
    Publication number: 20010028253
    Abstract: A base layer, which is preferably flexible, has first conductor tracks, a first insulation layer, fine structures with first electrodes, second conductor tracks and second electrodes, and finally a second insulation layer applied to it in succession. The first electrodes are connected, via plated-through holes, to associated first conductor tracks. Changes, caused by lines in the skin of a finger pad, in the stray capacitance between adjacent first and second electrodes are evaluated for recording fingerprints.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 11, 2001
    Inventors: Maximilian Zellner, Jorg Zapf, Peter Demmer