Abstract: Disclosed herein are a detachable part of a susceptor, a susceptor including the detachable part, and a substrate support assembly including the susceptor. The susceptor includes a plurality of cutouts coupled with the detachable part that includes an arc-shaped rim. The arc-shape rim includes an inner diameter, an outer diameter that is greater than the inner diameter, a first top surface, and a first bottom surface. The detachable part further includes a plurality of protrusions disposed along the inner diameter of the arc-shaped rim. The plurality of the protrusions include a second top surface that is disposed below the first top surface. When the susceptor is included in the substrate support assembly, a cylindrical ring is coupled with both a body of the substrate support assembly and the susceptor.

Abstract: Disclosed herein are a detachable part of a susceptor, a susceptor including the detachable part, a substrate support assembly including the susceptor, and a processing chamber having the same. In one example, the processing chamber includes a chamber body having an interior volume, a heating module, a susceptor, and a rotatable cylinder. The heating module is arranged to direct radiation into the interior volume. The susceptor has a disk shape and is disposed in the interior volume of the chamber body to support a substrate. The susceptor is rotatable on a vertical axis and fabricated from an opaque material. The rotatable cylinder is disposed in the interior volume and has an upper circumference supporting the susceptor thereon.

Abstract: A processing system is provided including a first chamber and a second chamber. The first chamber includes: a chamber body enclosing an interior volume; an edge ring having a top and a bottom, the edge ring including a first ledge extending inwardly from the top and a second ledge extending inwardly relative to the first ledge. The first ledge is configured to support a substrate and the second ledge is configured to support a susceptor. The first chamber further includes a plurality of heating lamps positioned over the edge ring. The second chamber includes: a chamber body enclosing an interior volume; a first cooling plate; one or more robots in the interior volume of the second chamber, the one or more robots having one or more end effectors positioned over the first cooling plate; and a plurality of lift pins extending through the first cooling plate.

Abstract: A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.

Abstract: Embodiments of the present disclosure include a radial frequency plasma source having a split type inner coil assembly. In one embodiment, the split type inner coil assembly comprises two intertwining coils. In another embodiment, the split type inner coil assembly includes looped coils forming a dome.

Abstract: Embodiments of the present disclosure include a radial frequency plasma source having a split type inner coil assembly. In one embodiment, the split type inner coil assembly comprises two intertwining coils. In another embodiment, the split type inner coil assembly includes looped coils forming a dome.

Abstract: A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.