Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: A connection arrangement is provided for a force-fit connecting ceramic components for a lithography apparatus. The connection arrangement includes first and a second ceramic components and a clamping device. The clamping device directly clamps the first and the second ceramic component against one another in a force-fit manner.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

Abstract: A connection arrangement is provided for a force-fit connecting ceramic components for a lithography apparatus. The connection arrangement includes first and a second ceramic components and a clamping device. The clamping device directly clamps the first and the second ceramic component against one another in a force-fit manner.

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

Abstract: A method and a device for replacing objective parts, especially of a projection or illumination objective for microlithography in which an objective having an objective interior and objective parts provided therein is provided. At least one objective part is replaceably accommodated in the objective. Immediately prior to installation in the objective, the replaceable objective part is cleaned outside the objective interior in at least one cleaning room sealed off from the ambient atmosphere. Immediately after cleaning, the replaceable objective is installed in the objective without contact with the normal ambient atmosphere.

Abstract: An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed of at least two releasably interconnected modules. Each module is composed of at least one carrier structure subelement. A subhousing is produced by a multiplicity of carrier structure subelements and/or modules. The subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in the projection exposure apparatus, the usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus. A projection exposure apparatus for EUV lithography includes such an optical arrangement.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: A method and a device for replacing objective parts, especially of a projection or illumination objective for microlithography in which an objective having an objective interior and objective parts provided therein is provided. At least one objective part is replaceably accommodated in the objective. Immediately prior to installation in the objective, the replaceable objective part is cleaned outside the objective interior in at least one cleaning room sealed off from the ambient atmosphere. Immediately after cleaning, the replaceable objective is installed in the objective without contact with the normal ambient atmosphere.

Abstract: An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed of at least two releasably interconnected modules. Each module is composed of at least one carrier structure subelement. A subhousing is produced by a multiplicity of carrier structure subelements and/or modules. The subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in the projection exposure apparatus, the usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus. A projection exposure apparatus for EUV lithography includes such an optical arrangement.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and components.

Abstract: A housing structure has a frame structure 1 on which there are arranged via connecting elements 7 several optical elements 5 which are held in mounts 6 or structural modules 6?. The optical elements 5 are detachably connected to the frame structure 1 with their mounts 6 or structural modules 6? and connecting elements 7 in such a way that in the installed state they are integrated as bearing units in the frame structure 1.

Abstract: A housing structure has a frame structure 1 on which there are arranged via connecting elements 7 several optical elements 5 which are held in mounts 6 or structural modules 6?. The optical elements 5 are detachably connected to the frame structure 1 with their mounts 6 or structural modules 6? and connecting elements 7 in such a way that in the installed state they are integrated as bearing units in the frame structure 1.

Abstract: There is provided an optical element module comprising a first optical element and an optical element holder. The first optical element has a first coefficient of thermal expansion. The optical element holder holds the first optical element and has a second coefficient of thermal expansion, the second coefficient of thermal expansion being adapted to the first coefficient of thermal expansion. The optical element is directly contacting the optical element holder in a wide contact area. The contact area is defined by a first contact surface of the first optical element and a second contact surface of the optical element holder, wherein the second contact surface matches the first contact surface. Thus, favorable rigidity and deformation behavior is provided.

Abstract: A lithographic apparatus has an assembly to exchange optical elements in a pupil plane of its projection system. The optical elements may be pupil filters and may conform to the physical dimensions specified for a reticle standard, e.g. having sides substantially equal to 5, 6 or 9 inches.

Abstract: A housing structure has a frame structure 1 on which there are arranged via connecting elements 7 several optical elements 5 which are held in mounts 6 or structural modules 6?. The optical elements 5 are detachably connected to the frame structure 1 with their mounts 6 or structural modules 6? and connecting elements 7 in such a way that in the installed state they are integrated as bearing units in the frame structure 1.