Patents by Inventor Peter Diehm

Peter Diehm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same
    Patent number: 6116495
    Abstract: A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8) The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: September 12, 2000
    Assignee: Siemens AG
    Inventors: Dietrich Richter, Peter Straub, Marian Lancki, Peter Diehm, Dieter Berchtold, Hans-Georg Wissmeier
  • Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same
    Patent number: 5914861
    Abstract: A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: June 22, 1999
    Assignees: Siemens AG, PPC Electronic AG
    Inventors: Dietrich Richter, Peter Straub, Marian Lancki, Peter Diehm, Dieter Berchtold, Hans-Georg Wissmeier