Patents by Inventor Peter DINGENEN

Peter DINGENEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
    Publication number: 20240119206
    Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 11, 2024
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
  • Systems and methods for designing a discrete device product
    Patent number: 11880642
    Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: January 23, 2024
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: James Joseph Victory, Thomas Neyer, YunPeng Xiao, Hyeongwoo Jang, Peter Dingenen, Vaclav Valenta, Mehrdad Baghaie Yazdi, Christopher Lawrence Rexer, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu, Roman Sickaruk
  • SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
    Publication number: 20230004700
    Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.
    Type: Application
    Filed: September 7, 2022
    Publication date: January 5, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
  • Systems and methods for designing a discrete device product
    Patent number: 11481532
    Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: October 25, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: James Joseph Victory, Thomas Neyer, YunPeng Xiao, Hyeongwoo Jang, Peter Dingenen, Vaclav Valenta, Tirthajyoti Sarkar, Mehrdad Baghaie Yazdi, Christopher Lawrence Rexer, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu, Roman Sickaruk
  • SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
    Publication number: 20210117598
    Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.
    Type: Application
    Filed: October 21, 2020
    Publication date: April 22, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Tirthajyoti SARKAR, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK