Patents by Inventor Peter Dirks

Peter Dirks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170327789
    Abstract: A method of promoting neural stem cell differentiation is provided comprising exposing neural stem cells to a dopamine D4 receptor antagonist.
    Type: Application
    Filed: November 13, 2015
    Publication date: November 16, 2017
    Inventors: Peter Dirks, Sonam Dolma
  • Publication number: 20170312274
    Abstract: A method of treating a brain tumour such as glioblastoma in a mammal is provided comprising administering to the mammal a DRD4 antagonist.
    Type: Application
    Filed: November 13, 2015
    Publication date: November 2, 2017
    Inventors: Peter Dirks, Sonam Dolma
  • Patent number: 8133764
    Abstract: A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: March 13, 2012
    Assignee: NPX B.V.
    Inventors: Peter Dirks, Klaas Heres
  • Patent number: 8067830
    Abstract: A dual or multiple row package (300) is provided which comprises a first plurality of terminals (303, 304, 305) and a second plurality of terminals (306, 307), which first and second plurality of terminals are exposed outside the encapsulation at a first side of the package. The terminals of the first plurality of terminals (303, 304, 305) are arranged in a first row (301), wherein a distance between each pair of adjacent terminals in the first row (301) is greater or equal than a first threshold value. Furthermore, the terminals of the second plurality of terminals (306, 307) are arranged in a second row (302), wherein a distance between each pair of adjacent terminals in the second row (302) is greater or equal than a second threshold and a distance between the first row (301) and the second row (302) is smaller than at least the first threshold value.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: November 29, 2011
    Assignee: NXP B.V.
    Inventors: Peter Dirks, Dirk Groeneveld
  • Publication number: 20100084756
    Abstract: A dual or multiple row package (300) is provided which comprises a first plurality of terminals (303, 304, 305) and a second plurality of terminals (306, 307), which first and second plurality of terminals are exposed outside the encapsulation at a first side of the package. The terminals of the first plurality of terminals (303, 304, 305) are arranged in a first row (301), wherein a distance between each pair of adjacent terminals in the first row (301) is greater or equal than a first thresholdvalue. Furthermore, the terminals of the second plurality of terminals (306, 307) are arranged in a second row (302), wherein a distance between each pair of adjacent terminals in the second row (302) is greater or equal than a second threshold and a distance between the first row (301) and the second row (302) is smaller than at least the first threshold value.
    Type: Application
    Filed: February 11, 2008
    Publication date: April 8, 2010
    Applicant: NXP, B.V.
    Inventors: Peter Dirks, Dirk Groeneveld
  • Publication number: 20100025840
    Abstract: A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.
    Type: Application
    Filed: February 11, 2008
    Publication date: February 4, 2010
    Applicant: NXP, B.V.
    Inventors: Peter Dirks, Klaas Heres
  • Publication number: 20090094703
    Abstract: Isolated medulloblastoma-forming clonogenic cells are provided which are useful to form stable cell lines as well as a non-human animal models of medulloblastoma that mimic human medulloblastoma, thereby providing a means to screen for candidate therapeutic compounds.
    Type: Application
    Filed: September 5, 2008
    Publication date: April 9, 2009
    Applicant: The Hospital For Sick Children
    Inventors: Peter Dirks, Ryan Ward, Chi-Chung Hui