Abstract: A test socket for integrated circuit packages has a body member carrying a plurality of pairs of opposed contacts on either side of a circuit package receiving cavity which seats a depressible spring loaded platform. When a circuit package is inserted, the contacts make electrical contact with the circuit package terminals and are deflected outwardly as the package is pressed downwardly. The force exerted by the deflected contacts and the terminals is sufficient to provide good electrical contact and to overcome the biasing force on the platform to retain the circuit package in the socket. The circuit package is released by a tool which has a cavity to receive the body member and cam elements to deflect the contacts and permit the spring-loaded platform to move upwardly and release the circuit package.