Patents by Inventor Peter Eiberger

Peter Eiberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for dicing composite wafers
    Patent number: 5369060
    Abstract: In a method for dicing multi-layer composite wafers, proceeding from an upper side of the wafer, cuts are introduced into an upper layer of the wafer and, proceeding from a lower side of the wafer, cuts are introduced into a lower layer of the wafer.
    Type: Grant
    Filed: June 1, 1993
    Date of Patent: November 29, 1994
    Assignee: Robert Bosch GmbH
    Inventors: Helmut Baumann, Juergen Kurle, Peter Eiberger