Abstract: A microelectromechanical loudspeaker. The loudspeaker includes a substrate, a housing arranged on the substrate, and a cavity delimited by the housing and the substrate. The loudspeaker includes a translation device, which is arranged in the cavity so as to be movable and deflectable in a specified movement direction parallel to the substrate surface and includes an arrangement of a plurality of movable fin structures, which are arranged next to one another in the movement direction and divide the cavity into a plurality of portions fluidically separated from one another, and a support structure connecting the movable fin structures to one another, and a drive device designed to deflect the translation device in the movement direction, including a plurality of drive units each including least one actuator electrode mechanically connected to the translation device and at least one stator electrode mechanically connected to the housing and/or the substrate.

Abstract: A microelectromechanical actuator structure including a microelectromechanical chip having a chip frame and a drive structure. The drive structure includes a first drive unit and a second drive unit. The first drive unit includes a first substrate and a first electrode structure. The first substrate has a first doping. The first electrode structure has a doping inverse to the first doping. The second drive unit includes a second substrate having a second doping and a second electrode structure having a doping inverse to the second doping. A pn junction is therefore formed between the substrates and the second electrode structures. The first electrode structure includes at least two first electrodes. The second electrode structure includes at least one second electrode. The first electrodes are arranged flat next to one another in a first electrode plane. The second electrode is arranged flat in a second electrode plane.

Abstract: A MEMS transducer interacting with a fluid. The MEMS transistor includes: a layer stack of at least three MEMS layer structures in a layer sequence, an active MEMS layer structure being formed between a lower MEMS layer structure and an upper MEMS layer structure; at least one lamella formed in the active MEMS layer structure and deflectable laterally for interacting with the fluid; and a drive device for deflecting the movable lamella in a lateral direction perpendicular to the layer sequence, with a lower and/or upper electrode structure, which is formed adjacent to the active MEMS layer structure on the lower and/or upper MEMS layer structure. For applying an electrical voltage to the upper and/or lower electrode structure, a through-connection of the upper or lower MEMS layer structure is provided, which is electrically conductively connected to a contact element formed in the active MEMS layer structure.

Abstract: A solar cell comprising: a semiconductor substrate; a metallization paste on a surface of the semiconductor substrate; and a tunneling layer between the substrate surface and the metallization paste.

Abstract: A solar cell comprising: a semiconductor substrate; a metallization paste on a surface of the semiconductor substrate; and a tunneling layer between the substrate surface and the metallization paste.

Abstract: A solar cell includes a semiconductor layer, a collecting layer for collecting free charge carriers from the semiconductor layer and a buffer layer which is arranged between the semiconductor layer and the collecting layer. The buffer layer is designed as a tunnel contact between the semiconductor layer and the collecting layer. The buffer layer essentially includes a material with a surface charge density of at least 1012 cm?2, preferably of at least 5×1012 cm?2, and more preferably of at least 1013 cm?2.

Abstract: A solar cell includes a semiconductor wafer, at least one dielectric layer arranged on the semiconductor wafer, a metal layer arranged on the dielectric layer, and a contact structure arranged in the dielectric layer such that the contact structure provides an electrical connection between the metal layer and the semiconductor wafer. The contact structure has at least one first structure having a minimum dimension and at least one second structure having a maximum dimension, wherein the minimum dimension and the maximum dimension are defined along a surface of the semiconductor wafer and the minimum dimension of the first structure is greater than the maximum dimension of the second structure.

Abstract: A semiconductor device, in particular a solar cell, comprises a semiconductor substrate having a semiconductor substrate surface and a passivation composed of at least one passivation layer which surface-passivates the semiconductor substrate surface, wherein the passivation layer comprises a compound composed of aluminium oxide, aluminium nitride or aluminium oxynitride and at least one further element.

Abstract: A semiconductor device, in particular a solar cell, comprises a semiconductor substrate having a semiconductor substrate surface and a passivation composed of at least one passivation layer which surface-passivates the semiconductor substrate surface, wherein the passivation layer comprises a compound composed of aluminum oxide, aluminum nitride or aluminum oxynitride and at least one further element.

Abstract: The invention relates to a semiconductor apparatus and a method of fabrication for a semiconductor apparatus, whereby the semiconductor apparatus includes a semiconductor layer and a passivation layer arranged on a surface of the semiconductor layer and serving for passivating the semiconductor layer surface, whereby the passivation layer comprises a chemically passivating passivation sublayer and a field-effect-passivating passivation sublayer, which are arranged one above the other on the semiconductor layer surface.

Abstract: A solar cell includes a semiconductor wafer, at least one dielectric layer arranged on the semiconductor wafer, a metal layer arranged on the dielectric layer, and a contact structure arranged in the dielectric layer such that the contact structure provides an electrical connection between the metal layer and the semiconductor wafer. The contact structure has at least one first structure having a minimum dimension and at least one second structure having a maximum dimension, wherein the minimum dimension and the maximum dimension are defined along a surface of the semiconductor wafer and the minimum dimension of the first structure is greater than the maximum dimension of the second structure.

Abstract: A method for fabricating a solar cell including a semiconductor substrate is proposed where electrical contacting is made on the back side of the semiconductor substrate. The back side of the semiconductor substrate has locally doped regions. The adjacent regions exhibit different doping from the region. The two regions are initially coated with electrically conductive material over the entire area. So that the conductive material does not short-circuit the solar cell, the two regions are covered with a thin electrically insulating layer at least at the region boundaries. The electrically conductive layer is separated by applying an etch barrier layer over the entire surface which is then removed free from masking and selectively e.g. by laser ablation, locally above the insulating layer. The conductive layer is locally removed in the area of the openings of the etch barrier layer by subsequent action of an etching solution.

Abstract: A process for producing a semiconductor device comprises the following process steps: provision of a semiconductor substrate (1); formation of a functional layer (2) on a semiconductor surface (11) of the semiconductor substrate (1); and production of at least one doped section (3) on the semiconductor surface (11) by driving a dopant into the semiconductor substrate (1) from the functional layer (2). The functional layer (2) is formed in such a way that it passivates the semiconductor surface (11), acting as a passivation layer upon completion of the semiconductor device.

Abstract: The invention relates to a solar cell with a semiconductor wafer comprising a light incidence facing front side with a base electrode, which is connected to a base layer of the semiconductor wafer, and a front side opposite to the back side with an emitter electrode, which is connected to an emitter structure of the semiconductor wafer, characterized by that the emitter structure comprises a front side emitter layer arranged on the front side of the semiconductor wafer.

Abstract: The invention relates to a semiconductor apparatus and a method of fabrication for a semiconductor apparatus, whereby the semiconductor apparatus includes a semiconductor layer and a passivation layer arranged on a surface of the semiconductor layer and serving for passivating the semiconductor layer surface, whereby the passivation layer comprises a chemically passivating passivation sublayer and a field-effect-passivating passivation sublayer, which are arranged one above the other on the semiconductor layer surface.

Abstract: A process for producing a semiconductor device comprises the following process steps: provision of a semiconductor substrate (1); formation of a functional layer (2) on a semiconductor surface (11) of the semiconductor substrate (1); and production of at least one doped section (3) on the semiconductor surface (11) by driving a dopant into the semiconductor substrate (1) from the functional layer (2). The functional layer (2) is formed in such a way that it passivates the semiconductor surface (11), acting as a passivation layer upon completion of the semiconductor device.

Abstract: A solar cell includes a semiconductor layer, a collecting layer for collecting free charge carriers from the semiconductor layer and a buffer layer which is arranged between the semiconductor layer and the collecting layer. The buffer layer is designed as a tunnel contact between the semiconductor layer and the collecting layer. The buffer layer essentially includes a material with a surface charge density of at least 1012 cm?2, preferably of at least 5×1012 cm?2, and more preferably of at least 1013 cm?2.

Abstract: A semiconductor device, in particular a solar cell, comprises a semiconductor substrate having a semiconductor substrate surface and a passivation composed of at least one passivation layer which surface-passivates the semiconductor substrate surface, wherein the passivation layer comprises a compound composed of aluminium oxide, aluminium nitride or aluminium oxynitride and at least one further element.

Abstract: A solar cell includes a semiconductor layer with first doping, an inducing layer arranged on the semiconductor layer and an inversion layer or accumulation layer which due to the inducing layer is induced underneath the inducing layer in the semiconductor layer. The inducing layer includes a material with a surface charge density of at least 1012 cm?2, preferably of at least 5×1012 cm?2, more preferably of at least 1013 cm?2.

Abstract: A method for fabricating a solar cell comprising a semiconductor substrate is proposed where electrical contacting is made on the back side of the semiconductor substrate. The back side of the semiconductor substrate has locally doped regions. The adjacent regions exhibit different doping from the region. The two regions are initially coated with electrically conductive material over the entire area. So that the conductive material does not short-circuit the solar cell, the two regions are covered with a thin electrically insulating layer at least at the region boundaries. The electrically conductive layer is separated by applying an etch barrier layer over the entire surface which is then removed free from masking and selectively e.g. by laser ablation, locally above the insulating layer. The conductive layer is locally removed in the area of the openings of the etch barrier layer by subsequent action of an etching solution.