Abstract: A waveguide switch for switching between an ON-state and an OFF-state for a waveguide channel, including: a moveable waveguide switch body including: an input opening for receiving an electromagnetic wave, an output opening for releasing an electromagnetic wave, wherein the waveguide switch body further includes a blocking element arranged such that in the ON state, an electromagnetic wave may pass from the input opening to the output opening, and in the OFF state the blocking element substantially impedes an electromagnetic wave traveling from the input opening to the output opening, whereby the switch from the ON state to the OFF state is a rotational or translation movement of the waveguide switch body. Also, a waveguide system employing such a switch and a method of manufacturing such a switch. Contactless switching is provided in a high-frequency system.

Abstract: A waveguide switch for switching between an ON-state and an OFF-state for a waveguide channel, including: a moveable waveguide switch body including: an input opening for receiving an electromagnetic wave, an output opening for releasing an electromagnetic wave, wherein the waveguide switch body further includes a blocking element arranged such that in the ON state, an electromagnetic wave may pass from the input opening to the output opening, and in the OFF state the blocking element substantially impedes an electromagnetic wave traveling from the input opening to the output opening, whereby the switch from the ON state to the OFF state is a rotational or translation movement of the waveguide switch body. Also, a waveguide system employing such a switch and a method of manufacturing such a switch. Contactless switching is provided in a high-frequency system.

Abstract: A nanostructure energy storage device comprising: a first electrode provided on an electrically insulating surface portion of a substrate; a plurality of conductive nanostructures provided on the first electrode; a conduction controlling material conformally coating each nanostructure in the plurality of conductive nanostructures; and a second electrode covering the conduction controlling material, wherein the first electrode and the second electrode are configured to allow electrical connection of the nanostructure energy storage device to an integrated circuit.

Abstract: A nanostructure energy storage device comprising: at least a first plurality of conductive nanostructures provided on an electrically insulating surface portion of a substrate; a conduction controlling material embedding each nanostructure in said first plurality of conductive nanostructures; a first electrode connected to each nanostructure in said first plurality of nanostructures; and a second electrode separated from each nanostructure in said first plurality of nanostructures by said conduction controlling material, wherein said first electrode and said second electrode are configured to allow electrical connection of said nanostructure energy storage device to an integrated circuit.

Abstract: A nanostructure energy storage device comprising: at least a first plurality of conductive nanostructures provided on an electrically insulating surface portion of a substrate; a conduction controlling material embedding each nanostructure in said first plurality of conductive nanostructures; a first electrode connected to each nanostructure in said first plurality of nanostructures; and a second electrode separated from each nanostructure in said first plurality of nanostructures by said conduction controlling material, wherein said first electrode and said second electrode are configured to allow electrical connection of said nanostructure energy storage device to an integrated circuit.

Abstract: An interposer device comprising an interposer substrate; a plurality of conducting vias extending through the interposer substrate; a conductor pattern on the interposer substrate, and a nanostructure energy storage device. The nanostructure energy storage device comprises at least a first plurality of conductive nanostructures formed on the interposer substrate; a conduction controlling material embedding each nanostructure in the first plurality of conductive nanostructures; a first electrode connected to each nanostructure in the first plurality of nanostructures; and a second electrode separated from each nanostructure in the first plurality of nanostructures by the conduction controlling material, wherein the first electrode and the second electrode are configured to allow electrical connection of the nanostructure energy storage device to the integrated circuit.

Abstract: An interposer device comprising an interposer substrate; a plurality of conducting vias extending through the interposer substrate; a conductor pattern on the interposer substrate, and a nanostructure energy storage device. The nanostructure energy storage device comprises at least a first plurality of conductive nanostructures formed on the interposer substrate; a conduction controlling material embedding each nanostructure in the first plurality of conductive nanostructures; a first electrode connected to each nanostructure in the first plurality of nanostructures; and a second electrode separated from each nanostructure in the first plurality of nanostructures by the conduction controlling material, wherein the first electrode and the second electrode are configured to allow electrical connection of the nanostructure energy storage device to the integrated circuit.

Abstract: A microwave/millimeter device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces is disclosed. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave/millimeter wave device further includes one or more conducting elements, such as a metallized ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency, the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

Abstract: A microwave/millimeter device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces is disclosed. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave/millimeter wave device further includes one or more conducting elements, such as a metallized ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency, the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

Abstract: A novel silicon micromirror structure for improving image fidelity in laser pattern generators is presented. In some embodiments, the micromirror is formed from monocrystalline silicon. Analytical- and finite element analysis of the structure as well as an outline of a fabrication scheme to realize the structure are given. The spring constant of the micromirror structure can be designed independently of the stiffness of the mirror-surface. This makes it possible to design a mirror with very good planarity, resistance to sagging during actuation, and it reduces influence from stress in reflectivity-increasing multilayer coatings.

Abstract: A force sensor (200) and nanoidenation system (300) using such force sensor (200), wherein the force sensor (200) comprise a movable membrane (207) attached to a fixed bulk structure (210) with springs (201, 202, 203, 204) formed between the membrane (207) and bulk structure (210); the springs (201, 202, 203, 204) may be provided two on each side of a rectangular membrane(207) and each in the form of a U-shape with displacing elements (801) formed perpendicular to each open end of each U-shaped spring (800). The force sensor further comprises electrodes (206) for detecting capacitive changes between the movable membrane (207) and the electrodes (206) in order to measure a movement in relation to an applied force. The membrane (207) further comprises a probe holding structure (214) for providing a solution for interchangeable probes (211).

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: A novel silicon micromirror structure for improving image fidelity in laser pattern generators is presented. In some embodiments, the micromirror is formed from monocrystalline silicon. Analytical—and finite element analysis of the structure as well as an outline of a fabrication scheme to realize the structure are given. The spring constant of the micromirror structure can be designed independently of the stiffness of the mirror-surface. This makes it possible to design a mirror with very good planarity, resistance to sagging during actuation, and it reduces influence from stress in reflectivity-increasing multilayer coatings.

Abstract: In recent years there has been a growing market for more universal analysis instruments. Analysis tools such as AFM1, TEM2 and nanoindentation work in similar environments. It is therefore possible, within limits, to use the same equipment to do all of these analyses. Conducting nanoindentation experiments in a TEM has also the advantage of increased accuracy compared to the tests done today. 1 Atomic Force Microscopy 2 Transmission Electron Microscope This project is focused on design and fabrication of a capacitive force sensor for AFM and/or nanoindentation measurements in a TEM. Nanofactory Instruments, the initiator of this, project, has developed a specimen holder for TEM that can be used for nanoindentation experiments. The measurement system used today has its limitations of being to large to be mounted in a TEM and thus an improved model was desired.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.

Abstract: A medical electrode for obtaining biopotentials from the skin of a subject or electrically stimulating the subject's skin and deeper tissue layers. The electrode has a carrier base member from which project a plurality of spikes arranged in an array on one surface of the base member. The spikes are sufficiently long to penetrate through the stratum corneum into the stratum germinativum of the subject's skin. The spikes may be formed by a deep reactive ion etching process on a silicon wafer forming the base member. A fluid container may be formed on another surface of the skin for providing a drug to the surface of the skin through holes in the base member. The action of the spikes on the skin enhances administration of the drug.

Abstract: An integrated circuit combines micro-machined elements, piezoelectric elements and signal processing components as part of a compensated oscillating gyroscopic sensor for angular motion detection. An oscillating mass is supported on a number of flexible beams micro-machined into an integrated circuit device, such as a silicon CMOS device. Several Piezo-electric elements are also coupled to the beams to excite the mass and to measure the accelerations. Integrated in the device are electronic circuitry that initiates and maintains the oscillation and electronic circuitry that detects and measures the subsequent motion. Additional circuitry is also provided to determine the Coriolis acceleration and thus the magnitude of the external perturbing velocity.