Patents by Inventor Peter F. COXETER
Peter F. COXETER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963324Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.Type: GrantFiled: March 23, 2021Date of Patent: April 16, 2024Assignee: Apple Inc.Inventors: Yohji Hamada, John J. Baker, Peter F. Coxeter, Benjamin M. Rappoport, Joseph B. Walker
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Patent number: 11668026Abstract: A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.Type: GrantFiled: May 17, 2019Date of Patent: June 6, 2023Assignee: Apple Inc.Inventors: Peter F. Coxeter, Didio V. Gomes, Benjamin J. Grena, Steven J. Keating, David M. Kindlon, Maurice P. May, Daniel A. Podhajny, Andrew L. Rosenberg, Daniel D. Sunshine
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Patent number: 11504945Abstract: An item may be formed from structures that include holes. Stitching may be used to form a seam that joins the structures. The stitching may be formed from a chain stitch that passes through the holes. The holes may be formed from loops of knit fabric or other holes. Leather layers, polymer layers, fabric layers, and other structures with holes may be joined using the stitching. During fabrication, a layer of material with holes may be placed on an adjustable-shape fixture having a bed of needles. The shape of the bed of nails in the adjustable-shape fixture may then be changed. After the fixture has been used to transform the shape of one or more of the structures, the structures may be placed on needles in an assembly fixture and the stitching between the structures may be formed. The item may be an electronic device cover or other item.Type: GrantFiled: March 19, 2019Date of Patent: November 22, 2022Assignee: Apple Inc.Inventors: Sofiane Berlat, Aedhan M. Loomis, Peter F. Coxeter, Sarah J. Montplaisir, Timon A. Wright, Yohji Hamada, Patrick Perry, Chad J. Miller, Andrew L. Rosenberg, Daniel A. Podhajny, Daniel D. Sunshine, Jessica J. Lu, Lia M. Uesato, Donald L. Olmstead
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Publication number: 20210212228Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.Type: ApplicationFiled: March 23, 2021Publication date: July 8, 2021Inventors: Yohji Hamada, John J. Baker, Peter F. Coxeter, Benjamin M. Rappoport, Joseph B. Walker
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Patent number: 10966332Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.Type: GrantFiled: February 8, 2018Date of Patent: March 30, 2021Assignee: Apple Inc.Inventors: Yohji Hamada, John J. Baker, Peter F. Coxeter, Benjamin M. Rappoport, Joseph B. Walker
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Publication number: 20200087823Abstract: A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.Type: ApplicationFiled: May 17, 2019Publication date: March 19, 2020Inventors: Peter F. Coxeter, Didio V. Gomes, Benjamin J. Grena, Steven J. Keating, David M. Kindlon, Maurice P. May, Daniel A. Podhajny, Andrew L. Rosenberg, Daniel D. Sunshine
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Patent number: 10568396Abstract: A woven material (100) including bonding fibers (108) and a method of reinforcing woven material using bonding fibers is disclosed. The woven material (100) includes a plurality of warp threads (102), and at least one weft thread (104) coupled to the warp threads (102). The woven material (100) also includes a plurality of bonding fibers (108). The bonding fibers (108) are positioned in parallel with the warp threads (102), and/or in parallel with the weft thread(s) (104). Additionally, the bonding fibers (108) are formed from a material having a melting temperature that is lower than a melting temperature of the material(s) used to form the warp threads (102) and the weft thread(s) (104) of the woven material.Type: GrantFiled: July 12, 2015Date of Patent: February 25, 2020Assignee: APPLE INC.Inventors: Yoji Hamada, Peter F. Coxeter, Ying-Liang Su, Edward Siahaan, Whitney D. Mattson, Naoto Matsuyuki
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Publication number: 20190344536Abstract: An item may be formed from structures that include holes. Stitching may be used to form a seam that joins the structures. The stitching may be formed from a chain stitch that passes through the holes. The holes may be formed from loops of knit fabric or other holes. Leather layers, polymer layers, fabric layers, and other structures with holes may be joined using the stitching. During fabrication, a layer of material with holes may be placed on an adjustable-shape fixture having a bed of needles. The shape of the bed of nails in the adjustable-shape fixture may then be changed. After the fixture has been used to transform the shape of one or more of the structures, the structures may be placed on needles in an assembly fixture and the stitching between the structures may be formed. The item may be an electronic device cover or other item.Type: ApplicationFiled: March 19, 2019Publication date: November 14, 2019Inventors: Sofiane Berlat, Aedhan M. Loomis, Peter F. Coxeter, Sarah J. Montplaisir, Timon A. Wright, Yohji Hamada, Patrick Perry, Chad J. Miller, Andrew L. Rosenberg, Daniel A. Podhajny, Daniel D. Sunshine, Jessica J. Lu, Lia M. Uesato, Donald L. Olmstead
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Patent number: 10427374Abstract: Electronic equipment may include seamless spacer fabric. Seamless spacer fabric may be used as a protective case or cosmetic cover for an electronic device such as a speaker. A seamless spacer fabric may include a seamless fabric outer layer, a spacer fabric inner layer, and an adhesive layer that bonds the seamless outer layer to the spacer fabric inner layer. The spacer fabric layer may have a seam region where one portion of the spacer fabric layer is joined with another portion of the fabric layer. The seamless fabric outer layer may cover the seam region to hide it from view. One or more additional seam hiding layers or strips may be formed on opposing sides of the spacer fabric layer to cover the seam. The seamless spacer fabric may have an array of openings that extends uniformly around the perimeter of the seamless spacer fabric.Type: GrantFiled: March 13, 2018Date of Patent: October 1, 2019Assignee: Apple Inc.Inventors: Yohji Hamada, Siddhartha Hegde, Zebinah P. Masse, Rimple Bhatia, Peter F. Coxeter, Amit S. Barve, Donald L. Olmstead, Javier Mendez
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Publication number: 20180272644Abstract: Electronic equipment may include seamless spacer fabric. Seamless spacer fabric may be used as a protective case or cosmetic cover for an electronic device such as a speaker. A seamless spacer fabric may include a seamless fabric outer layer, a spacer fabric inner layer, and an adhesive layer that bonds the seamless outer layer to the spacer fabric inner layer. The spacer fabric layer may have a seam region where one portion of the spacer fabric layer is joined with another portion of the fabric layer. The seamless fabric outer layer may cover the seam region to hide it from view. One or more additional seam hiding layers or strips may be formed on opposing sides of the spacer fabric layer to cover the seam. The seamless spacer fabric may have an array of openings that extends uniformly around the perimeter of the seamless spacer fabric.Type: ApplicationFiled: March 13, 2018Publication date: September 27, 2018Inventors: Yohji Hamada, Siddhartha Hegde, Zebinah P. Masse, Rimple Bhatia, Peter F. Coxeter, Amit S. Barve, Donald L. Olmstead, Javier Mendez
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Publication number: 20180168059Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.Type: ApplicationFiled: February 8, 2018Publication date: June 14, 2018Inventors: Yohji Hamada, John J. Baker, Peter F. Coxeter, Benjamin M. Rappoport, Joseph B. Walker
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Patent number: 9894789Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.Type: GrantFiled: December 22, 2014Date of Patent: February 13, 2018Assignee: Apple Inc.Inventors: Yohji Hamada, John J. Baker, Peter F. Coxeter, Benjamin M. Rappoport, Joseph B. Walker
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Publication number: 20170224064Abstract: A woven material (100) including bonding fibers (108) and a method of reinforcing woven material using bonding fibers is disclosed. The woven material (100) includes a plurality of warp threads (102), and at least one weft thread (104) coupled to the warp threads (102). The woven material (100) also includes a plurality of bonding fibers (108). The bonding fibers (108) are positioned in parallel with the warp threads (102), and/or in parallel with the weft thread(s) (104). Additionally, the bonding fibers (108) are formed from a material having a melting temperature that is lower than a melting temperature of the material(s) used to form the warp threads (102) and the weft thread(s) (104) of the woven material.Type: ApplicationFiled: July 12, 2015Publication date: August 10, 2017Inventors: Yoji HAMADA, Peter F. COXETER, Ying-Liang SU, Edward SIAHAAN, Whitney D. MATTSON, Naoto MATSUYUKI
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Patent number: 9623646Abstract: The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.Type: GrantFiled: April 23, 2014Date of Patent: April 18, 2017Assignee: Apple Inc.Inventors: Harry W. Smith, IV, Peter F. Coxeter, Jonathan T. Mechak, Adam L. Nekimken, Julio C. Quintero
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Publication number: 20150158284Abstract: The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.Type: ApplicationFiled: April 23, 2014Publication date: June 11, 2015Applicant: Apple Inc.Inventors: Harry W. SMITH, IV, Peter F. COXETER, Jonathan T. MECHAK, Adam L. NEKIMKEN, Julio C. QUINTERO