Abstract: A suspension assembly is described. The suspension assembly including a rigid interposer circuit; a plurality of flexible circuits configured to attach to the rigid interposer circuit and movable about an x-axis and a y-axis with respect to the static plate; and a sensor mounting region on the rigid interposer circuit.

Abstract: Methods for producing flexible circuits can include creating treating a surface of the flexible circuit with at least one of an atmospheric plasma and a beam of ions. The atmospheric plasma is formed by directing a flow of gas between an electrode and the surface of the flexible circuit and generating a voltage between the electrode and the flexible circuit to create a plasma from the gas. A mean ion energy of the ions in the ion beam ranges from about 500 electron volts to about 1,500 electron volts.

Abstract: A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.

Abstract: An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Abstract: An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Abstract: Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.

Abstract: Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. In embodiments, the attachment structures include a first portion and a second portion configured to be crimped together. In embodiments, at least one of the first and second portions include an etched recess.

Abstract: A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.

Abstract: A camera lens suspension assembly includes a support member including a support metal base layer, a moving member including a moving metal base layer, bearings and smart memory alloy wires. The support member includes a bearing plate portion, static wire attach structures, and mount regions. A printed circuit on the support metal base layer includes traces extending to each static wire attach structure. The moving member includes a moving plate portion, elongated flexure arms extending from a periphery of the moving plate portion and including mount regions on ends opposite the moving plate portion, and moving wire attach structures. The bearings are between and engage the bearing plate portion of the support member and the moving plate portion of the moving member. Each of the smart memory alloy wires is attached to and extends one of the static wire attach structures and one of the moving wire attach structures.

Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

Abstract: A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Abstract: An electrode tab is described. The electrode tab including a base layer and an outer layer disposed on the base layer. The base layer including a sensor.

Abstract: A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.

Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Abstract: A suspension assembly is described. The suspension assembly including a static member or plate; a moving member or plate movable about an x-axis and a y-axis with respect to the static plate; a sensor mounting region on the moving plate; and one or more shape memory alloy (SMA) elements extending between and coupled to the static plate and moving plate. The SMA elements, when driven by a controller, move the moving plate and the sensor mounting region thereon about the x-axis and the y-axis with respect to the static plate.