Patents by Inventor Peter Falvo

Peter Falvo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for dicing a substrate with back metal
    Patent number: 10497621
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: December 3, 2019
    Assignee: Plasma-Therm LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
  • Method for Dicing a Substrate with Back Metal
    Publication number: 20180254215
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Application
    Filed: May 6, 2016
    Publication date: September 6, 2018
    Applicant: Plasma-Therm, LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
  • Method for Dicing a Substrate with Back Metal
    Publication number: 20160254189
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Application
    Filed: May 6, 2016
    Publication date: September 1, 2016
    Applicant: Plasma-Therm, LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
  • Method for dicing a substrate with back metal
    Patent number: 9368404
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: June 14, 2016
    Assignee: Plasma-Therm LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
  • Method for Dicing a Substrate with Back Metal
    Publication number: 20140094018
    Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.
    Type: Application
    Filed: September 23, 2013
    Publication date: April 3, 2014
    Applicant: PLASMA-THERM, LLC
    Inventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman