Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterized in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased. The laser light (65) is also guided, by means of optical fibers, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.

Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterised in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased.; The laser light (65) is also guided, by means of optical fibres, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.