Abstract: A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body, and a first thermal detector extending from the probe body. The thermal detector is used to position the cantilever with respect to a test sample.

Abstract: A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe comprises a probe body, a first cantilever extending from the probe body, and a first thermal detector extending from the probe body. The thermal detector is used to position the cantilever with respect to a test sample.

Abstract: A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.

Abstract: A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.

Abstract: A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.

Abstract: A method for aligning a probe relative to a Supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, using an etch reagent, a recess in the exposed area, the recess defining first and second opposed sidewalls, an end wall remote from the edge, and a bottom wall. The method further includes the step of providing a probe substrate defining a second planar surface and a second crystal plane identical to the first crystal plane, and positioning the probe substrate so that the first and the second crystal planes are positioned identically when forming a probe from the probe substrate using the etch reagent, wherein the probe defines congruent surfaces to the first and second sidewalls.

Abstract: An electrical feedback detection system for detecting electrical contact between a multi-point probe and an electrically conducting material test sample surface. The electrical feedback detection system comprises an electrical detector unit connected to a multitude of electrodes in the multi-point probe, and optionally directly to the test sample surface. The detector unit provides an electrical signal to a multi-point testing apparatus, which can be used to determine if the multi-point probe is in electrical contact with the test sample surface. The detector unit comprises an electrical generator means for generating an electrical signal that is driven through a first multitude of electrodes of the multi-point probe, and a second multitude of switched impedance detection elements. The electrical potential across the impedance detection elements determines the electrical contact to the test sample surface.

Abstract: The multi-point probe comprises a supporting body defining a first surface, a first multitude of conductive probe arms each of the probe arms defining a proximal end and a distal end being positioned in co-planar relationship with the first surface of the supporting body. The probe arms are connected to the supporting body at the proximal ends thereof and have the distal ends freely extending from the supporting body, giving individually flexible motion to the first multitude of probe arms. The probe arms originate from a process of producing the probe arms on a wafer body in facial contact with the wafer body and removal of a part of the wafer body providing the supporting body and providing the probe arms freely extending therefrom. The multi-point probe further comprises a third multitude of tip elements extending from the distal end of the first multitude of probe arms. The tip elements originate from a process of metallization of electron beam depositions on the probe arms at the distal ends thereof.

Abstract: An electrical feedback detection system for detecting electrical contact between a multi-point probe and an electrically conducting material test sample surface. The electrical feedback detection system comprises an electrical detector unit connected to a multitude of electrodes in the multi-point probe, and optionally directly to the test sample surface. The detector unit provides an electrical signal to a multi-point testing apparatus, which can be used to determine if the multi-point probe is in electrical contact with the test sample surface. The detector unit comprises an electrical generator means for generating an electrical signal that is driven through a first multitude of electrodes of the multi-point probe, and a second multitude of switched impedance detection elements. The electrical potential across the impedance detection elements determines the electrical contact to the test sample surface.

Abstract: A multi-point probe, a method for producing the multi-point probe and a cylindrical nano-drive for in particular driving the multi-point probe in a multi-point testing apparatus for testing electric properties on a specific location of a test sample. The multi-point probe comprises a supporting body defining a first surface, a first multitude of conductive probe arms each of the conductive probe arms defining a proximal end and a distal end being positioned in co-planar relationship with the first surface of the supporting body. The conductive probe arms are connected to the supporting body at the proximal ends thereof and have the distal ends freely extending from the supporting body, giving individually flexible motion to the first multitude of conductive probe arms.