Abstract: A milling assembly for a ball mill has a housing for refining and separating a substrate and a collection vessel for retaining the refined substrate. The housing includes, in vertical order, a lid, at least one milling vessel for receiving milling balls, and a screen with a refining section and apertures. The collection vessel is releasably mounted to a bottom end of the housing. The housing has an orifice arranged therein. The orifice has a valve for selectively allowing gas to pass between an outside and an inside of the housing in an open position of the valve and to seal the housing against the outside in a closed position of the valve. The milling vessel includes a taper for receiving a sealing screw.

Abstract: An ion-mobility spectrometer system includes a housing with an upstream end, a downstream end, and a drift region defined along a longitudinal axis through the housing between the upstream and downstream ends. A first ionizer is operatively connected the housing to supply ions at the upstream end. A second ionizer is operatively connected to the housing to supply ions at the upstream end, wherein the first and second ionizers are both situated upstream of the drift zone relative to an ion flow path through the drift zone. An electric field generator is operatively connected to the housing to drive ions through the drift zone in a direction from the upstream end toward the downstream end. The second ionizer is a radioactive ionizer mounted to the housing at the upstream end positioned to direct irradiated ions into the housing.

Abstract: An ion-mobility spectrometer system includes a housing with an upstream end, a downstream end, and a drift region defined along a longitudinal axis through the housing between the upstream and downstream ends. A first ionizer is operatively connected the housing to supply ions at the upstream end. A second ionizer is operatively connected to the housing to supply ions at the upstream end, wherein the first and second ionizers are both situated upstream of the drift zone relative to an ion flow path through the drift zone. An electric field generator is operatively connected to the housing to drive ions through the drift zone in a direction from the upstream end toward the downstream end. The second ionizer is a radioactive ionizer mounted to the housing at the upstream end positioned to direct irradiated ions into the housing.

Abstract: A system for multi-stage differential mobility spectrometer (multi-stage DMS) and the method of operating and using the same are described. Ions produced in an ionization source are introduced into the separation region of multi-stage DMS, which includes at least two DMS stages. Each DMS stage is configured to generate separation and compensation fields to characterize, separate, or select ion species. The separation region further includes ion alteration stages which are placed between various adjacent stages of multi-stage DMS. Alteration of ions can be both chemical and physical. Ions which are separated, altered, and selectively passed by all DMS stages of multi-stage DMS are then measured or further characterized by the Faraday plate detectors or a mass spectrometer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

Abstract: A first wafer is provided that includes an insulating layer, a first active layer, and a handle layer. The insulating layer has a first surface and a second surface. The first active layer contacts the first surface of the insulating layer. The handle layer contacts the second surface of the insulating layer. A second wafer is provided that includes a substrate and a second active layer. The substrate has a first surface and a second surface. The second active layer contacts the first surface of the substrate. The second wafer is bonded to the first wafer by physically connecting the first active layer to the second surface of the substrate. The handle layer is removed. A metal bond pad is formed on the second surface of the insulating layer. The metal bond pad is electrically connected to the first active layer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate.

Abstract: An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer.

Abstract: A picture location tagging system and method. A system in accordance with the present invention comprises a processor, an image sensor, coupled to the processor, for recording the image, a location generator, coupled to the processor, for receiving location-determining signals from a location-determining system, and a memory, coupled to the processor, for storing the image and for storing the location-determining signals, wherein the location-determining signals are associated with the image.

Abstract: A combined telephone AED simply integrates the function of a telephone and an alphanumeric entry device required for alphanumeric paging into a single unit by making use of the handset cradle switch to reset the unit from page mode to telephone mode whenever the handset is lifted. Paging operation is simplified through pre-stored entries in a directory giving both voice and paging numbers with the appropriate number being identified by the previously selected mode of the operation of the unit. Special purpose paging and speed dial buttons serve the combined function of identifying a mode of operation and initiating a search of the directory to reduce the number of keystrokes required of a user during typical operation.

Abstract: There is disclosed herein a method and means for the collection and introduction of sample gases into a mass spectrometer gas analyzer.