Abstract: An apparatus including an elongate body having a lumen extending therethrough and a steering wire, having a distal portion defining a non-circular cross-section, associated with the distal portion of the elongate body.

Abstract: A method for demolding a body of frozen confection encased in a flexible disposable mold includes the steps of slicing the mold, applying heat to the mold sufficient to soften a surface portion of the body of confection to permit the mold to slip from the body, directing gas into the slit mold to open the mold and to separate the mold from the body, and applying suction to the mold to pull the mold free of the body. The invention further includes an assembly for effecting the method, the assembly including a slicer, a heater, a blower, and a suction device.

Abstract: Medical reports are a key component of a patient's medical history. Medical reports, however, often contain lexicon that is inconsistent and of insufficient detail leading to problems in analyzing the medical reports. Additionally, creating detailed medical reports can be very time consuming. The present method for creating a medical report, therefore, comprises examining at least one of a patient or test results of a patient, summarizing findings of the examination, having access to previously created phrases describing in greater detail at least one of the summarized findings, choosing at least one of the previously created phrases based upon at least one of the summarized findings, and generating a report utilizing the previously created phrases.

Abstract: An apparatus including an elongate body having a lumen extending therethrough and a steering wire, having a distal portion defining a non-circular cross-section, associated with the distal portion of the elongate body.

Abstract: An apparatus including an elongate body having a lumen extending therethrough and a steering wire, having a distal portion defining a non-circular cross-section, associated with the distal portion of the elongate body.

Abstract: A multilayer thin film structure having defined strap repair lines thereon and a method for repairing interconnections in the multilayer thin film structure (MLTF) and/or making engineering changes (EC) are provided. The method determines interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, defines the top surface metallization including a series of orthogonal X conductor lines and Y conductor lines using photoresist and lithography and additive or subtractive metallization techniques and then uses a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forms the top surface metallization.

Abstract: A handheld device, such as a personal digital assistant (“PDA”), can be used at the point-of-care to find an appropriate pair of diagnosis code and procedure code for use in writing an order for further medical procedures for a particular patient. The choice of diagnosis code and procedure code can be checked for conformance with the requirements set forth in a particular set of medical necessity policy rules. In a preferred embodiment, the codes and rules are aggregated by medical specialty so that a specialist can work with solely those codes and rules that are relevant to that particular medical specialty. This abstract is provided as a tool for those searching for patents, and not as a limitation on the scope of the claims.

Abstract: A device repair process that includes removing a passivation polyimide layer. The passivation polyimide layer is removed using a first-half ash followed by a second-half ash. The device is rotated during the second-half ash. The device is then cleaned using sodium hydroxide (NaOH) and a subsequent light ash step is implemented. After the passivation polyimide layer is removed, a seed layer is deposited on the device. A photoresist is formed on the seed layer and bond sites are formed in the photoresist. Repair metallurgy is plated through the bond sites. The bond sites are plated by coupling the device to a fixture and applying the current for plating to the fixture. The contact between the device and the fixture is made though bottom surface metallurgy. After plating, the residual seed layer is removed and a laser delete process is implemented to disconnect and isolate the nets of the device.

Abstract: A multilayer thin film structure having defined strap repair lines thereon and a method for repairing interconnections in the multilayer thin film structure (MLTF) and/or making engineering changes (EC) are provided. The method comprises determining interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, defining the top surface metallization including a series of orthogonal X conductor lines and Y conductor lines using photoresist and lithography and additive or phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization.

Abstract: A method for reading information about a specific sample of a particular product or a health care service into a medical information manager system. In a preferred embodiment, information about a specific sample of a medication is used as: 1) part of product sample tracking; 2) included in the health care records for the particular patient receiving the specific sample; and to 3) partially populate a prescription for additional quantities of the particular product provided in the specific sample.

Abstract: A jewelry clasp with two ends for connecting to a necklace. A latch has an aperture in the periphery thereof and aligns with one of two apertures defined by the discontinuous periphery of the clasp. An actuator located on the latch is provided so as to move the latch. Once the latch aperture is aligned with one of the respective apertures in the clasp, a jump ring on the end of a necklace may be attached to an end of the clasp.

Abstract: A device repair process that includes removing a passivation polyimide layer. The passivation polyimide layer is removed using a first-half ash followed by a second-half ash. The device is rotated during the second-half ash. The device is then cleaned using sodium hydroxide (NaOH) and a subsequent light ash step is implemented. After the passivation polyimide layer is removed, a seed layer is deposited on the device. A photoresist is formed on the seed layer and bond sites are formed in the photoresist. Repair metallurgy is plated through the bond sites. The bond sites are plated by coupling the device to a fixture and applying the current for plating to the fixture. The contact between the device and the fixture is made though bottom surface metallurgy. After plating, the residual seed layer is removed and a laser delete process is implemented to disconnect and isolate the nets of the device.

Abstract: A device repair process that includes removing a passivation polyimide layer. The passivation polyimide layer is removed using a first-half ash followed by a second-half ash. The device is then cleaned using sodium hydroxide (NaOH) and a subsequent light ash step is implemented. After the passivation polyimide layer is removed, a seed layer is deposited on the device. A photoresist is formed on the seed layer and bond sites are formed in the photoresist. Repair metallurgy is plated through the bond sites. The bond sites are plated by coupling the device to a fixture and applying the current for plating to the fixture. The contact between the device and the fixture is made though bottom surface metallurgy. After plating, the residual seed layer is removed and a laser delete process is implemented to disconnect and isolate the nets of the device.

Abstract: A multilayer thin film structure (MLTF) is provided having no extraneous via-pad connection strap plated metallurgy for defective vias needing removal. The method for making or repairing the MLTF comprises determining interconnection defects in the MLTF at a thin film layer adjacent to the top metal layer of the structure, applying a top surface dielectric layer and forming vias in the layer, applying a metal conducting layer and removing the metal conducting layer for via-pad connection straps of defective vias and at the intersection of XY lines used in the repair, defining the top surface metallization including a series of orthogonal X conductor repair lines and Y conductor repair lines using a photoresist and lithography and then using a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization using additive or subtractive metallization techniques.

Abstract: A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.

Abstract: A device repair process that includes removing a passivation polyimide layer. The passivation polyimide layer is removed using a first-half ash followed by a second-half ash. The device is rotated during the second-half ash. The device is then cleaned using sodium hydroxide (NaOH) and a subsequent light ash step is implemented. After the passivation polyimide layer is removed, a seed layer is deposited on the device. A photoresist is formed on the seed layer and bond sites are formed in the photoresist. Repair metallurgy is plated through the bond sites. The bond sites are plated by coupling the device to a fixture and applying the current for plating to the fixture. The contact between the device and the fixture is made though bottom surface metallurgy. After plating, the residual seed layer is removed and a laser delete process is implemented to disconnect and isolate the nets of the device.

Abstract: A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.

Abstract: A Process for graphically assisting the partial repair of defective MCM TF wiring nets. The process comprises the steps of inserting the wiring layer of the thin-film device in a tester, scanning the wiring layer of the thin-film device with the tester, identifying defects in the wiring nets, prioritizing the defects based on a function of each of the defective wiring nets, and repairing the defects based on priority.

Abstract: The present invention relates to a method for the elimination of false negative test results in assays for the detection of amplified analyte nucleic acid in a sample. Prior to amplification, an internal control is added to the sample, comprising a nucleic acid distinguishable from the analyte nucleic acid, that can be amplified with the same amplification reagents as the analyte nucleic acid. Preferably the internal control comprises a nucleic acid sequence corresponding to the analyte nucleic acid that has been mutated to discriminate it from the analyte nucleic acid.

Abstract: The invention is an improved method for the amplification of nucleic acid, wherein ribonucleotides that weaken normal base pairing are introduced during amplification. Preferably, the ribonucleotides are inosine-triphosphate nucleotides which partly substitute guanine-triphosphate nucleotides normally present in the amplification reaction mixture. These ribonucleotides weaken normal base pairing and prevent the formation of secondary structures in the amplificate, thereby increasing the efficiency of amplification. Also, improved sensitivity results during detection of the amplified nucleic acid when the detection method comprises the hybridization of the amplified nucleic acid to a complementary sequence.