Patents by Inventor Peter G. Hartwell

Peter G. Hartwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10383967
    Abstract: Emission of a scented substance, which is mixed with a tracer substance, is controlled based on an amount of the tracer substance sensed during the emission of the scented substance. The scented substance can be mixed with the tracer substance in a known defined ratio. When the mixture of the scented substance and tracer substance is being emitted by a device, a substance sensor component can sense the amount of the tracer substance being emitted. An emission management component can control the emission of the mixture of substances based on the amount of the tracer substance detected to facilitate controlling the amount of the scented substance being emitted. The emission management component also can control emission of the scented substance in a defined area based on the tracer substance and environmental conditions in the defined area. The tracer substance can be safe, colorless, and/or odorless with respect to people.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: August 20, 2019
    Assignee: INVENSENSE, INC.
    Inventor: Peter G. Hartwell
  • Patent number: 10200581
    Abstract: Techniques provided for using hardware and software to modify a mobile device to improve the safety and awareness of a user to their environmental surroundings. One embodiment of the invention is to update mobile device applications to include live video using the built in rear camera of area ahead of the user as background image. Rear camera would normally be viewing ground, so an embodiment includes a custom case or other attachment to the mobile device with a mirror to allow rear camera to view area ahead. The case or attachment positions the mirror relative to the camera and has an adjustable angle to achieve the correct field of view for the way (or posture) the user is holding the mobile device.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: February 5, 2019
    Inventor: Peter G. Hartwell
  • Publication number: 20180147311
    Abstract: Emission of a scented substance, which is mixed with a tracer substance, is controlled based on an amount of the tracer substance sensed during the emission of the scented substance. The scented substance can be mixed with the tracer substance in a known defined ratio. When the mixture of the scented substance and tracer substance is being emitted by a device, a substance sensor component can sense the amount of the tracer substance being emitted. An emission management component can control the emission of the mixture of substances based on the amount of the tracer substance detected to facilitate controlling the amount of the scented substance being emitted. The emission management component also can control emission of the scented substance in a defined area based on the tracer substance and environmental conditions in the defined area. The tracer substance can be safe, colorless, and/or odorless with respect to people.
    Type: Application
    Filed: November 30, 2016
    Publication date: May 31, 2018
    Inventor: Peter G. Hartwell
  • Patent number: 9980069
    Abstract: Various embodiments provide for an acoustically configurable microphone device that can adjust various parameters affecting sensitivity, acoustic overload point, signal to noise ratio, sample rate, and other parametric choices that affect the performance and function of the acoustic sensor based on commands received via acoustic communications. An acoustic analysis engine can analyze acoustic communications received to determine whether or not the acoustic communication contains a command associated with configuring the microphone. If the acoustic communication is determined to contain a configuration command, a controller on the microphone can implement the configuration command. The acoustic communications can be at ultrasonic frequencies in some embodiments so that the acoustic communications are outside the range of human hearing.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: May 22, 2018
    Assignee: INVENSENSE, INC.
    Inventor: Peter G. Hartwell
  • Publication number: 20180063661
    Abstract: Various embodiments provide for an acoustically configurable microphone device that can adjust various parameters affecting sensitivity, acoustic overload point, signal to noise ratio, sample rate, and other parametric choices that affect the performance and function of the acoustic sensor based on commands received via acoustic communications. An acoustic analysis engine can analyze acoustic communications received to determine whether or not the acoustic communication contains a command associated with configuring the microphone. If the acoustic communication is determined to contain a configuration command, a controller on the microphone can implement the configuration command. The acoustic communications can be at ultrasonic frequencies in some embodiments so that the acoustic communications are outside the range of human hearing.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 1, 2018
    Inventor: Peter G. Hartwell
  • Publication number: 20170289488
    Abstract: Techniques provided for using hardware and software to modify a mobile device to improve the safety and awareness of a user to their environmental surroundings. One embodiment of the invention is to update mobile device applications to include live video using the built in rear camera of area ahead of the user as background image. Rear camera would normally be viewing ground, so an embodiment includes a custom case or other attachment to the mobile device with a mirror to allow rear camera to view area ahead. The case or attachment positions the mirror relative to the camera and has an adjustable angle to achieve the correct field of view for the way (or posture) the user is holding the mobile device.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 5, 2017
    Inventor: Peter G. Hartwell
  • Patent number: 9752877
    Abstract: An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. To reduce offset in the electronic compass, the magnetic flux concentrators may be demagnetized by applying a current to a coil in the housing. The coil may be formed from loops of metal traces within a printed circuit or other loops of conductive paths. Magnetic flux concentrators may have ring shapes. A ring-shaped magnetic flux concentrator may be formed from multiple thin stacked layers of soft magnetic material separated by non-magnetic material.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: September 5, 2017
    Assignee: Apple Inc.
    Inventors: Manoj K Bhattacharyya, Christopher E. Balcells, Jian Guo, Peter G. Hartwell
  • Patent number: 9656856
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: May 23, 2017
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9571008
    Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: February 14, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robert G. Walmsley
  • Publication number: 20160340175
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Publication number: 20160313122
    Abstract: An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. To reduce offset in the electronic compass, the magnetic flux concentrators may be demagnetized by applying a current to a coil in the housing. The coil may be formed from loops of metal traces within a printed circuit or other loops of conductive paths. Magnetic flux concentrators may have ring shapes. A ring-shaped magnetic flux concentrator may be formed from multiple thin stacked layers of soft magnetic material separated by non-magnetic material.
    Type: Application
    Filed: August 27, 2015
    Publication date: October 27, 2016
    Inventors: Manoj K Bhattacharyya, Christopher E. Balcells, Jian Guo, Peter G. Hartwell
  • Patent number: 9446941
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 20, 2016
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Publication number: 20160167949
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Publication number: 20140042869
    Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.
    Type: Application
    Filed: June 28, 2011
    Publication date: February 13, 2014
    Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robet G. Walmsley
  • Patent number: 8390444
    Abstract: A sensor-location system for locating sensors in a tract covered by an earth-based sensor network. The sensor-location system includes at least one sensor-identification device, and at least one sensor locator. The sensor-identification device is affixed to a respective sensor in the earth-based sensor network. The sensor locator is configured for use from on board of an aircraft. In addition, the sensor locator is configured to acquire geographic-location data of said sensor including an identifying signature from the sensor-identification device of the sensor in the tract covered by the earth-based sensor network.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: March 5, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Zhiyong Li, Peter G. Hartwell
  • Publication number: 20110303011
    Abstract: A sensor apparatus, a sensor system and a method employ coupling characterization of a sensor housing to a local environment. The apparatus includes a vibration sensor and a vibration actuator attached to and enclosed by the sensor housing in a spaced apart relationship. The vibration actuator is configured to vibrate the sensor housing with a vibration signal to excite a coupling between the sensor housing and the local environment. A response of the sensor housing to the vibration signal is indicative of a coupling characteristic of the coupling. The system further includes a coupling structure. The method includes coupling the sensor housing to the local environment, vibrating the sensor housing with the vibration actuator and detecting the response that is indicative of the coupling characteristic.
    Type: Application
    Filed: June 15, 2010
    Publication date: December 15, 2011
    Inventors: Kai-Mei Camilla Fu, John Paul Strachan, Peter G. Hartwell
  • Publication number: 20110267171
    Abstract: A sensor-location system for locating sensors in a tract covered by an earth-based sensor network. The sensor-location system includes at least one sensor-identification device, and at least one sensor locator. The sensor-identification device is affixed to a respective sensor in the earth-based sensor network. The sensor locator is configured for use from on board of an aircraft. In addition, the sensor locator is configured to acquire geographic-location data of said sensor including an identifying signature from the sensor-identification device of the sensor in the tract covered by the earth-based sensor network.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Inventors: Zhiyong LI, Peter G. Hartwell
  • Patent number: 8030754
    Abstract: One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: October 4, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter G. Hartwell, Duncan Stewart
  • Patent number: 7618752
    Abstract: One or more of a contact lithography module, a pattern tool and a substrate include a strain control region to prevent deformation-related misalignment.
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: November 17, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Duncan R. Stewart, Robert Walmsley, Peter G. Hartwell, Wei Wu
  • Publication number: 20080181558
    Abstract: One embodiment in accordance with the invention is an apparatus that can include an optical circuit wafer and an integrated circuit wafer. The optical circuit wafer and the integrated circuit wafer are bonded together by a wafer bonding process.
    Type: Application
    Filed: January 31, 2007
    Publication date: July 31, 2008
    Inventors: Peter G. Hartwell, Raymond Beausoleil, R. Stanley Williams, Duncan Stewart