Abstract: The baseband unit includes a first Radio Frequency (RF) coverage unit, a second RF coverage unit, and an interface unit. The first RF coverage unit is configured to communicate with RF devices according to a first communication protocol. The second RF coverage unit is configured to communicate with the RF devices according to a second communication protocol different than the first communication protocol. Further, the interface unit is configured to selectively interface one of the first and second coverage units with the RF devices.

Abstract: An outdoor stackable telecommunications equipment cabinet family and a method of deploying an outdoor telecommunications equipment cabinet. In one embodiment, the family includes: (1) a plurality of selectable cabinet modules and (2) a plurality of selectable plinth modules, at least one of the plurality of selectable cabinet modules and one of the plurality of selectable plinth modules configured to be selected and stacked to form an outdoor telecommunications equipment cabinet that includes an air filter and at least one fan.

Abstract: A wireless communication base station assembly includes at least one base band unit (40) having one primary circuit board (100) with circuitry for a control function (102), a timing function (104), a line interface function (106) and a radio interface function (108). The electronics and circuitry for each of these functions are all supported on the one primary circuit board (100). At least one channel module (e.g., a channel card) is coupled to the primary circuit board. A single, generally rectangular housing (42) contains the primary circuit board and the channel module. Disclosed examples include a rack (50) having a plurality of slots (52) configured to accommodate the housing (42).

Abstract: The baseband unit includes a first Radio Frequency (RF) coverage unit, a second RF coverage unit, and an interface unit. The first RF coverage unit is configured to communicate with RF devices according to a first communication protocol. The second RF coverage unit is configured to communicate with the RF devices according to a second communication protocol different than the first communication protocol. Further, the interface unit is configured to selectively interface one of the first and second coverage units with the RF devices.

Abstract: A wireless communication base station assembly includes at least one base band unit (40) having one primary circuit board (100) with circuitry for a control function (102), a timing function (104), a line interface function (106) and a radio interface function (108). The electronics and circuitry for each of these functions are all supported on the one primary circuit board (100). At least one channel module (e.g., a channel card) is coupled to the primary circuit board. A single, generally rectangular housing (42) contains the primary circuit board and the channel module. Disclosed examples include a rack (50) having a plurality of slots (52) configured to accommodate the housing (42).

Abstract: A wireless communication system (20) includes a base station (22) and remotely located radio frequency units (30, 32). A passive antenna arrangement (60) associated with each radio frequency unit conveniently and economically provides radio frequency coverage within otherwise difficult-to-reach areas. Disclosed examples include radio frequency units at various locations within a building (50) that is effectively divided into sectors served by the base station.

Abstract: A system and method distributes wireless signals to areas remote from a base station by incorporating a backplane fiber card connected to a backplane in a base station and a radio fiber card connected to a radio. The backplane fiber card and the radio fiber card are connected together by one or more fiber links, which carry signals between the two fiber cards. The radio can therefore be placed at any location within the length of the fiber link, remote from the backplane. The backplane fiber card can be plugged into a radio card slot in the backplane. In one embodiment, the fiber cards have connectors that connect to standard backplane and radio structures, allowing the invention to be incorporated in existing systems without any modifications to the radio or the backplane itself.

Abstract: A multi-layer backplane for processing radio frequency (RF) and other signals has alternating layers of conductive traces for RF signals and other types of signals, and ground plane layers of conductive material electrically insulated from each other. The backplane upper layer has a plurality of coaxial connectors for connection of cables and other devices which supply RF energy signals to and convey them from the backplane, with each connector having a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer. A ground plane cap layer of electrically conductive material is provided below the last ground plane layer associated with a trace layer and beneath the coaxial connector center pins for preventing leakage of radio frequency energy between the center pins. A row of conductive vias can be provided along one or more sides of a trace carrying RF energy.

Abstract: The present invention is directed to a lifting and positioning system for use by a single person in installing onto or removing from an elevated position a microcell module, all without the aid of major powered machinery. In addition to the use of a portable hoist, a bracket for permanently mounting the microcell module to a desired surface at the installation site, and a lifting bracket that detachably mounts to the module, the lifting and positioning system of the present invention uses structural features of the microcell module itself to simplify installation and removal. In this latter manner, only a relatively small number of parts need to be carried to the installation site, and can be done so safely and without undue bodily strain.

Abstract: An enclosure for electronic components which is provided with a heater mounted to an exterior wall to maintain a minimum operating temperature for the electronic components without utilizing space within the enclosure.