Abstract: A glass composition includes greater than or equal to 60 mol % to less than or equal to 66 mol % SiO2, greater than or equal to 14 mol % to less than or equal to 16 mol % Al2O3, greater than or equal to 7 mol % to less than or equal to 9 mol % Li2O, greater than or equal to 4 mol % to less than or equal to 6 mol % Na2O, greater than or equal to 0.5 mol % to less than or equal to 3 mol % P2O5, greater than or equal to 0.5 mol % to less than or equal to 6 mol % B2O3; and greater than 0 mol % to less than or equal to 1 mol % TiO2. The glass composition may have a fracture toughness of greater than or equal 0.75 MPa?m. A glass composition includes SiO2, Al2O3, Li2O, Na2O, P2O5, and B2O3, wherein a molar ratio of Li2O/Na2O is greater than or equal to 1.2 to less than or equal to 2.0, the glass has a liquidus viscosity in the range from greater than or equal to 50 kP to less than or equal to 75 kP, and the glass has a KIC fracture toughness greater than or equal to 0.75 MPa·m0.5.

Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.

Abstract: Glass compositions are provided with low Young's modulus and compatibility with slot drawing techniques, due at least in part to liquidus viscosity and liquidus temperature. When ion-exchanged the resulting glass articles are capable of exhibiting a ratio of a peak compressive stress value in MPa to a Young's modulus value in GPa of 13.0 or more. The glass articles may have a peak compressive stress value in a range of 850 MPa to 1400 MPa. The glass articles are suitable for various high-strength applications, including cover glass applications that experience significant bending stresses during use, for example, cover glasses for flexible displays.

Abstract: Glass-based articles comprise stress profiles providing improved fracture resistance. The glass-based articles herein provide high fracture resistance after multiple drops.

Abstract: An audio plug for mounting on a printed circuit board, comprising: an insulative housing; a plurality of contacts, each of them being comparted by the insulative housing, wherein each contact has a front portion for mating with an audio jack and a back portion, said back portion has a plurality of welding portions with flat welding plates for welding the audio plug to the printed circuit board. Welding the PCB with the welding plates instead of welding cable saves the materials and spaces; and the flat welding plates with more area than the traditional audio plug makes the welding easier; the PCB is harder than the cable that makes the audio plug strength.

Abstract: A transducer system and method for harmonic imaging is provided. At least one transducer element is provided. The transducer element comprises two or more stacked piezoelectric layers. Information from each of the layers is independently processed during one of a transmit event, a receive event, and both transmit and receive events. Information from the transducer element is provided to a filter. The filter isolates harmonic information for imaging. By providing a multi-layer transducer element with independent processing for each layer, a wide bandwidth transducer for harmonic imaging is provided. The null associated with most transducers at the second harmonic of a fundamental frequency is removed or lessened.