Patents by Inventor Peter H. Farmer
Peter H. Farmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7047637Abstract: Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.Type: GrantFiled: April 15, 2004Date of Patent: May 23, 2006Inventors: L. Pierre deRochemont, Peter H. Farmer
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Publication number: 20040194305Abstract: Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.Type: ApplicationFiled: April 15, 2004Publication date: October 7, 2004Applicant: L. Pierre deRochemont d/b/a C2 TechnologiesInventors: L. Pierre deRochemont, Peter H. Farmer
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Patent number: 6742249Abstract: Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.Type: GrantFiled: November 21, 2001Date of Patent: June 1, 2004Inventors: L. Pierre deRochemont, Peter H. Farmer
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Publication number: 20020031918Abstract: A method of manufacture of a composite wiring structure for use with at least one semiconductor device. The composite wiring structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor being electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.Type: ApplicationFiled: November 21, 2001Publication date: March 14, 2002Applicant: L. Pierre deRochemont d/b/a C2 TechnologiesInventors: L. Pierre deRochemont, Peter H. Farmer
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Patent number: 6323549Abstract: A composite wiring structure (10) for use with at least one semiconductor device (16). The composite wiring structure having a first conductive member (12) upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member (20), made of ceramic or organo-ceramic composite material, is bonded to the first conductive member (12) and contains embedded therein a conductive network (24) and a thermal distribution network (26). A second conductive member (32) may be incorporated with the composite wiring structure, with a capacitor (64) being electrically connected between the conductive network (24) and the second conductive member (32). Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.Type: GrantFiled: June 25, 1999Date of Patent: November 27, 2001Inventors: L. Pierre deRochemont, Peter H. Farmer
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Patent number: 6143432Abstract: A ceramic composite having a substrate bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880.degree. C., and ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, and higher level assemblies including such devices.Type: GrantFiled: January 9, 1998Date of Patent: November 7, 2000Assignee: L. Pierre deRochemontInventors: L. Pierre de Rochemont, Peter H. Farmer
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Patent number: 5739270Abstract: A method and apparatus for continuously separating polymer from a plastic, and the resulting separated polymer. The plastic is made flowable into a stream through melting or solubilizing. A critical fluid, such as supercritical carbon dioxide, is added to the plastic stream to promote mechanical or thermodynamic separation of the polymer from contaminants and other components of the plastic.Type: GrantFiled: August 1, 1995Date of Patent: April 14, 1998Inventors: Peter H. Farmer, John M. Moses
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Patent number: 5707715Abstract: A metal-ceramic composite comprised of a metal member bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880.degree. C., and metal-ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with ferrite or alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, EMI shields and higher level assemblies including such devices.Type: GrantFiled: August 29, 1996Date of Patent: January 13, 1998Assignee: L. Pierre deRochemontInventors: L. Pierre deRochemont, Peter H. Farmer
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Patent number: 5547736Abstract: A plastic sheet, preferably of plasticized partial polyvinyl butyral, for a laminated safety glazing, having means dispersed on its surface, preferably comprising a multiplicity of spaced projections, capable of resisting adhesion to a rigid panel, such as glass, of such a glazing when the sheet is laminated to the panel, the area of the sheet surface without such dispersed means having high affinity for adhesion. The projections physically block adhesion of a dispersed area of the sheet to the panel in that the means on the sheet surface have no or weak interfacial adhesion. The multiplicity of space projections also have low or no affinity for adhesion when in blocking contact with each other or with another plasticized partial polyvinyl butyral surface and thereby increase blocking resistance.Type: GrantFiled: December 19, 1994Date of Patent: August 20, 1996Assignee: Monsanto CompanyInventors: Robert H. M. Simon, Peter H. Farmer
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Patent number: 5478412Abstract: A plastic sheet, preferably of plasticized partial polyvinyl butyral, for a laminated safety glazing, having means dispersed on its surface, preferably comprising a multiplicity of spaced projections, capable of resisting adhesion to a rigid panel, such as glass, of such a glazing when the sheet is laminated to the panel, the area of the sheet surface without such dispersed means having high affinity for adhesion. The projections physically block adhesion of a dispersed area of the sheet to the panel in that the means on the sheet surface have no or weak interfacial adhesion. The multiplicity of space projections also have low or no affinity for adhesion when in blocking contact with each other or with another plasticized partial polyvinyl butyral surface and thereby increase blocking resistance.Type: GrantFiled: June 7, 1993Date of Patent: December 26, 1995Assignee: Monsanto CompanyInventors: Robert H. M. Simon, Peter H. Farmer
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Patent number: 5342653Abstract: A method of producing plasticized partial polyvinyl butyral sheet having a desired level of potential adhesion to glass which comprises: i) providing partial polyvinyl butyral resin having a high affinity for adhesion to glass when in sheet form under laminating conditions of elevated temperature and pressure, ii) mixing the resin with plasticizer to form a heat-shapable formulation, iii) extruding the formulation to form a sheet, and iv) applying a multiplicity of spaced anti-adhesion projections to the surface of the sheet to an extent effective to counteract the high adhesion of the sheet to glass between projections.Type: GrantFiled: June 7, 1993Date of Patent: August 30, 1994Assignee: Monsanto CompanyInventors: Robert H. M. Simon, Peter H. Farmer
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Patent number: 4973511Abstract: A laminated window construction includes a solar control film formed by a flexible plastic substrate such as a PET sheet having on one surface a multilayer solar coating. This multilayer solor coating includes at least one thin layer of metal and at least one adjacent adherent layer of a dielectric material. An energy absorbing safety film of the type normally used in shatterproof glass laminates (e.g., plasticized PVB) is bonded to at least one side, and preferably both sides, of the solar control film to form a composite solar/safety film. This composite solar/safety film is specially designed to contribute, after incorporation into a glass laminate, no more than about two percent of visible reflection (based on total incident visible radiation) which has the effect of substantially masking the visible effects of wrinkles in the solar control film substrate (i.e., the wrinkles are made less visible).Type: GrantFiled: December 1, 1988Date of Patent: November 27, 1990Assignee: Monsanto CompanyInventors: Peter H. Farmer, Stanley S. Ho, Raymond F. Riek, Floyd E. Woodard
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Patent number: 4902464Abstract: Polyvinyl butyral (PVB) resin lightly cross-linked through stable intermolecular linkages developed, for example, through use of a dialdehyde or trialdehyde, to selectively increase PVB molecular weight and the modulus of a plasticized sheet formed therefrom intended for use in laminated safety glass assemblies.Type: GrantFiled: December 7, 1988Date of Patent: February 20, 1990Assignee: Monsanto CompanyInventors: George E. Cartier, Peter H. Farmer
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Patent number: 4874814Abstract: Polyvinyl butyral (PVB) resin lightly cross-linked through stable intermolecular linkages developed, for example, through use of a dialdehyde or trialdehyde, to selectively increase PVB molecular weight and the modulus of a plasticized sheet formed therefrom intended for use in laminated safety glass assemblies.Type: GrantFiled: February 27, 1989Date of Patent: October 17, 1989Assignee: Monsanto CompanyInventors: George E. Cartier, Peter H. Farmer
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Patent number: 4814529Abstract: Polyvinyl butyral (PVB) resin lightly cross-linked through stable intermolecular linkages developed, for example, through use of a dialdehyde or trialdehyde, to selectively increase PVB molecular weight and the modulus of a plasticized sheet formed therefrom intended for use in laminated safety glass assemblies.Type: GrantFiled: November 24, 1986Date of Patent: March 21, 1989Inventors: George E. Cartier, Peter H. Farmer
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Patent number: 4654179Abstract: Extruded polyvinyl butyral (PVB) sheet roughness is controlled by use of PVB resin lightly cross-linked through stable intermolecular linkages.Type: GrantFiled: July 2, 1985Date of Patent: March 31, 1987Assignee: Monsanto CompanyInventors: George E. Cartier, Peter H. Farmer
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Patent number: 4281980Abstract: A flexible lip die blade is provided in which local flexing of the blade is brought about by activation of heaters located in connector members connecting the flexible lip with the body of the die blade.Type: GrantFiled: January 18, 1980Date of Patent: August 4, 1981Assignee: Monsanto CompanyInventors: John C. Hoagland, Peter H. Farmer, Rocco M. Carabetta, Jr.
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Patent number: 4252519Abstract: An improved slit die for extruding thermoplastic sheet and having the capacity for fine gauge control comprises a die blade and an opposed surface in which the local separation between the two is variable by the generation of localized expansion and contraction forces in the body of the die blade while isolating the die blade lip from temperature variations by the provision of a heat barrier means.Type: GrantFiled: November 16, 1979Date of Patent: February 24, 1981Assignee: Monsanto CompanyInventors: Peter H. Farmer, Timothy J. Fowler, John C. Hoagland