Abstract: An apparatus and method for sensor architecture based on bulk machining of silicon wafers and fusion bond joining which provides a nearly all-silicon, hermetically sealed, microelectromechanical system (MEMS) device. An example device includes a device sensor mechanism formed in an active semiconductor layer and separated from a handle layer by a dielectric layer, and a silicon cover plate having a handle layer with a dielectric layer being bonded to portions of the active layer. Pit are included in one of the handle layers and corresponding dielectric layers to access electrical leads on the active layer. Another example includes set backs from the active components formed by anisotropically etching the handle layer while the active layer has been protectively doped.

Abstract: A method for a geometry of a lateral comb drive for an in-plane, electrostatic force feedback, closed-loop, micromachined accelerometer or closed-loop Coriolis rate gyroscope device, or closed-loop capacitive pressure or force measuring device. When vibration is applied to the device, the error in the time-average output, which is vibration rectification error, due to this input vibration is minimized or eliminated. The geometry resulting from practice of the present invention is space-efficient because drive force is maximized while vibration rectification is minimized or eliminated.

Abstract: An apparatus and method for sensor architecture based on bulk machining of silicon wafers and fusion bond joining which provides a nearly all-silicon, hermetically sealed, microelectromechanical system (MEMS) device. An example device includes a device sensor mechanism formed in an active semiconductor layer and separated from a handle layer by a dielectric layer, and a silicon cover plate having a handle layer with a dielectric layer being bonded to portions of the active layer. Pit are included in one of the handle layers and corresponding dielectric layers to access electrical leads on the active layer. Another example includes set backs from the active components formed by anisotropically etching the handle layer while the active layer has been protectively doped.

Abstract: A method for a geometry of a lateral comb drive for an in-plane, electrostatic force feedback, closed-loop, micromachined accelerometer or closed-loop Coriolis rate gyroscope device, or closed-loop capacitive pressure or force measuring device. When vibration is applied to the device, the error in the time-average output, which is vibration rectification error, due to this input vibration is minimized or eliminated. The geometry resulting from practice of the present invention is space-efficient because drive force is maximized while vibration rectification is minimized or eliminated.

Abstract: A method for a geometry of a lateral comb drive for an in-plane, electrostatic force feedback, closed-loop, micromachined accelerometer or closed-loop Coriolis rate gyroscope device, or closed-loop capacitive pressure or force measuring device. When vibration is applied to the device, the error in the time-average output, which is vibration rectification error, due to this input vibration is minimized or eliminated. The geometry resulting from practice of the present invention is space-efficient because drive force is maximized while vibration rectification is minimized or eliminated.

Abstract: A microelectromechanical system (MEMS) device with a mechanism layer having a first part and a second part, and at least one cover for sealing the mechanism layer. The inner surface of at least one of the covers is structured such that a protruding structure is present on the inner surface of the cover and wherein the protruding structure mechanically causes the first part to be deflected out of a plane associated with the second part.

Abstract: An apparatus and method for sensor architecture based on bulk machining of silicon wafers and fusion bond joining which provides a nearly all-silicon, hermetically sealed, microelectromechanical system (MEMS) device. An example device includes a device sensor mechanism formed in an active semiconductor layer and separated from a handle layer by a dielectric layer, and a silicon cover plate having a handle layer with a dielectric layer being bonded to portions of the active layer. Pit are included in one of the handle layers and corresponding dielectric layers to access electrical leads on the active layer. Another example includes set backs from the active components formed by anisotropically etching the handle layer while the active layer has been protectively doped.

Abstract: A Micro-Electro-Mechanical System closed-loop (MEMS) inertial device having a vertical comb drive that exhibits improved performance under vibration. The device includes one or more stator tines extending from a housing into a cavity formed by the housing. One or more rotor tines extend from a proof mass located in the cavity. The proof mass is joined to the housing by flexures which allow movement in the vertical direction. The rotor tines have a first length value in the direction of movement and the stator tines have a second length value in the direction of movement. The second length value is greater than the first length value. Also, the stator tines include two electrically separated portions. The lesser length of the rotor tines relative to the stator tines causes the attractive force between the rotor tines and either the upper or lower half of the stator tines to be relatively independent of rotor vertical position. This, in turn, produces better accelerometer accuracy in vibration environments.

Abstract: An apparatus and method for sensor architecture based on bulk machining of Silicon-On-Oxide wafers and fusion bonding that provides a symmetric, nearly all-silicon, hermetically sealed MEMS device having a sensor mechanism formed in an active semiconductor layer, and opposing silicon cover plates each having active layers bonded to opposite faces of the sensor mechanism. The mechanism is structured with sensor mechanical features structurally supported by at least one mechanism anchor. The active layers of the cover plates each include interior features structured to cooperate with the sensor mechanical features and an anchor structured to cooperate with the mechanism anchor. A handle layer of each cover plate includes a pit extending there through in alignment with the cover plate anchor. An unbroken rim of dielectric material forms a seal between the cover plate anchor and the pit and exposes an external surface of the cover plate anchor.

Abstract: A stress isolation technique for an accelerometer of the type that has a reed that includes a paddle, a support, and flexures connecting the paddle to an area of the support. The support includes one or more mounting pads through which the reed is mounted. The area of the support adjacent to the flexures is divided into first and second portions, such that the flexures are connected to the first portion and such that the mounting pads are positioned solely on the second portion. The flexures are therefore isolated from stress coupled into the reed through the mounting pads.