Patents by Inventor Peter H. Renteln

Peter H. Renteln has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad and method for polishing semiconductor wafers
    Patent number: 5287663
    Abstract: A polishing pad and a method for polishing semiconductor wafers. The polishing pad includes a polishing layer and a rigid layer. The rigid layer adjacent the polishing layer imparts a controlled rigidity to the polishing layer. The resilient layer adjacent the rigid layer provides substantially uniform pressure to the rigid layer. During operation, the rigid layer and the resilient layer apply an elastic flexure pressure to the polishing layer to induce a controlled flex in the polishing layer to conform to the global topography of the wafer surface while maintaining a controlled rigidity over the local topography of the wafer surface.
    Type: Grant
    Filed: April 28, 1992
    Date of Patent: February 22, 1994
    Assignee: National Semiconductor Corporation
    Inventors: John M. Pierce, Peter H. Renteln