Abstract: A scheme for removing foreign material from the surface of a substrate by directing a high velocity aerosol of at least partially frozen particles against the foreign material to be removed. Different schemes are described for accelerating the frozen particles to very high velocities sufficient for particle removal, removal of organic layers (e.g., hard baked photoresist or ion implanted photoresist) and removal of metallic layers. In one embodiment, liquid droplets are entrained in a high velocity gas flow and the resulting gas/liquid mixture is passed through an expansion nozzle to produce a high velocity aerosol of frozen particles. In another embodiment, frozen aerosol particles are entrained in, e.g., a sonic or supersonic gas jet before impacting a surface to be cleaned. The cleaning aerosols may be applied to substrates inside a vacuum chamber or directly from a hand-held device.

Abstract: An ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The ion implantation system includes a high vacuum process chamber that mounts an ion source, a single workpiece translating stage, and a loadlock. The single workpiece handling assembly mounted within the process chamber both removes the workpiece from the loadlock and supports the workpiece during implantation by the ion beam generated by the ion source. The process chamber is in selective fluid communication with a loadlock assembly, which in turn is mechanically integrated with a workpiece loading or end station. Additionally, the workpiece handling assembly includes a translation stage or element for translating the workpiece in a linear scanning direction during implantation. This linear scanning direction extends along a path transverse or orthogonal to the horizontal longitudinal axis of the implantation system.

Abstract: In one aspect, foreign material on the surface of a substrate is processed to form a reaction product by: providing a directed flow of a fluid, comprising a reactant, to the vicinity of the foreign material to be processed; and delivering an aerosol of at least partially frozen particles continuously or intermittently to the foreign material to aid the reactant react with the foreign material to form the reaction product. In another aspect, foreign material is processed by: providing a directed flow of a fluid, comprising a reactant, to the foreign material to be processed in a limited area reaction region corresponding to a minor fraction of the total area of the substrate; agitating the foreign material in the limited area reaction region to aid the reactant react with the foreign material to form the reaction product; and providing relative motion between the substrate and the directed flow of fluid to achieve a substantially uniform exposure of the foreign material to fluid flow and the agitation.

Abstract: A scheme for removing foreign material from the surface of a substrate by directing a high velocity aerosol of at least partially frozen particles against the foreign material to be removed. Different schemes are described for accelerating the frozen particles to very high velocities sufficient for particle removal, removal of organic layers (e.g., hard baked photoresist or ion implanted photoresist) and removal of metallic layers. In one embodiment, liquid droplets are entrained in a high velocity gas flow and the resulting gas/liquid mixture is passed through an expansion nozzle to produce a high velocity aerosol of frozen particles. In another embodiment, frozen aerosol particles are entrained in, e.g., a sonic or supersonic gas jet before impacting a surface to be cleaned. The cleaning aerosols may be applied to substrates inside a vacuum chamber or directly from a hand-held device.

Abstract: A system and method for conductively and/or convectively transferring heat away from a workpiece that has been processed by a processing system, such as an ion implantation system. The conductive transfer of heat from the workpiece is effectuated by disposing the workpiece in relatively close proximity with a floor of a loadlock, which is maintained at a relatively cool temperature. The chamber pressure is disposed at a selected pressure by a pressure regulator and a vacuum pressure is applied to the backside of the workpiece closest to draw the workpiece into contact with the chamber floor, thereby effecting heat transfer from the workpiece to the cooling surface.

Abstract: A high throughput ion implantation system that rapidly and efficiently processes large quantities of flat panel displays. The ion implantation system has an ion chamber generating a stream of ions, a plasma electrode having an elongated slot with a high aspect ratio for shaping the stream of ions into a ribbon beam, and an electrode assembly for directing the stream of ions towards a workpiece. The plasma electrode can include a split extraction system having a plurality of elongated slots oriented substantially parallel to each other. The ion implantation system can also have a diffusing system for homogenizing the ion stream. Various exemplary diffusing systems include an apertured plate having an array of openings, diffusing magnets, diffusing electrodes, and dithering magnets.

Abstract: A high throughput ion implantation system that rapidly and efficiently processes large quantities of flat panel displays. The ion implantation system has an ion source, an electrode assembly, a platform mounting a workpiece, and a ion beam measuring structure. The ion source in conjunction with the electrode assembly forms an ion beam in the shape of a ribbon beam. The ion beam is formed and directed such that a first portion of the ion beam treats the workpiece while a second portion of the ion beam is contemporaneously measured by the beam measuring structure. A controller obtains data from the beam measuring structure on the ion beam's parameters, and then generates control signals to the ion implantation system in response to the data.

Abstract: An ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The ion implantation system includes a high vacuum process chamber that mounts an ion source, a single workpiece translating stage, and a loadlock. The single workpiece handling assembly mounted within the process chamber both removes the workpiece from the loadlock and supports the workpiece during implantation by the ion beam generated by the ion source. The process chamber is in selective fluid communication with a loadlock assembly, which in turn is mechanically integrated with a workpiece loading or end station. Additionally, the workpiece handling assembly includes a translation stage or element for translating the workpiece in a linear scanning direction during implantation. This linear scanning direction extends along a path transverse or orthogonal to the horizontal longitudinal axis of the implantation system.

Abstract: An ion source for generating an ion beam of primary ions is disclosed that includes a plasma chamber and magnets positioned therein for separating the primary ions of the plasma from secondary ions within the plasma. An electrode assembly extracts the primary ions through an extractor outlet port of the plasma chamber to form an ion beam, which preferentially is shaped as a ribbon beam. The primary ions are accelerated in the form of a ribbon beam toward the target workpiece for doping the device. The magnets are oriented in the chamber to produce a uniform current density of primary ions parallel to the elongated axis of the ribbon beam.

Abstract: The present invention provides a loadlock assembly for a high throughput ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The loadlock assembly increases the throughput of the implantation system by continuously cycling workpieces through the process chamber, thus increasing the system's throughput. The loadlock assembly includes a plurality of loadlock stacking elements that are axially positioned relative to each other to form a stacked array of loadlocks. Additionally, the loadlocks of the array are configured to nest with an adjacent loadlock to form a stackable and nestable loadlock assembly.

Abstract: An ion accelerator for use in an ion beam implanter. The accelerator forms milliampere beams of heavy ions such as boron and phosphorous in a configuration in which the terminal ion source is replaced by a neutral beam injector. The neutral beam is formed at ground by the conversion of a focused beam of positive ions to neutral ions in a charge exchange canal. The neutral beam so formed is stripped of one or more electrons in a gas or vapor filled canal in the high voltage terminal. A 180.degree. analyzing magnet located in the high voltage terminal analyzes and directs a selected charge state to an acceleration tube parallel to the neutral beam injection tube where the selected positive ions are accelerated to ground potential.

Abstract: A scheme for producing ions of a selected ion species and a selected ion energy comprising: an ion plasma source for generating an ion source plasma from a selected source gas and having an ion exit aperture; an extraction electrode for extracting and for accelerating ions from the exit aperture of the plasma source, the extraction electrode being positioned in the vicinity of the ion exit aperture of the ion plasma source, the ion source being biased at a potential relative to the extraction electrode to achieve a selected ion beam energy; a magnetic structure having pole faces that define a magnetic deflection gap therebetween and having an ion exit region where ions exit the magnetic deflection gap, the ion plasma source and the extraction electrode being positioned in the magnetic deflection gap so that when the magnetic structure is energized ions extracted from the plasma source corresponding to the selected species are deflected about an angular beam path trajectory of at least ninety degrees before ex

Abstract: A microwave energized ion source apparatus is supported by a support tube extending into a cavity defined by a housing assembly and includes a dielectric plasma chamber, a pair of vaporizers, a microwave tuning and transmission assembly and a magnetic field generating assembly. The chamber defines an interior region into which source material and ionizable gas are routed. The chamber is overlied by a cap having an arc slit through which generated ions exit the chamber. The microwave tuning and transmission assembly, which feeds microwave energy to the chamber in the TEM mode, includes a coaxial microwave energy transmission line center conductor. One end of the conductor fits into a recessed portion of the chamber and transmits microwave energy to the chamber. The center conductor extends through an evacuated portion of a coaxial tube surrounding the conductor. A vacuum seal is disposed in or adjacent the coaxial tube and from the boundary between the evacuated coaxial tube and a non-evacuated region.

Abstract: A magnetic scanning technique for sweeping an ion beam across an implantation target, such as a semiconductor wafer, by means of modulating the energy of a beam and directing it through an analyzer magnet, which effects a scanning motion of the beam of constant intensity, the wave form for the modulation being selected to take into account that the areal density of the ions in the scanned beam varies dependently with the amount of displacement of the beam from a reference point. An ion scan can be obtained in which the ions travel in parallel paths and enter the target at a constant desired angle throughout the scan. The technique is applicable to targets held stationary or rotated during implant. By employing predetermined modulation wave forms which are adapted to other parameters of the selected system, a desired scan distribution of ions can be obtained, for instance a uniform distribution in X and Y directions.

Abstract: Apparatus for accurately measuring the charge distribution, and hence the voltage, on a non-conducting workpiece during ion bombardment. The invention is based on the principal that the charge on the surface of the workpiece induces equal and opposite charge on the surface of an isolated proof plane conductor placed in front of it. A workpiece is moved at a known speed in front of the proof plane, whose dimensions are small compared to the workpiece. The measurement of the time distribution of the induced charge on the proof plane is a measure of the spatial distribution of the charge on the bombarded workpiece. The proof plane surface is isolated from currents which might flow directly to its surface.

Abstract: Scanning, as of ion beams, in which two radially aligned devices, e.g. ion source and extraction electrode, are isolated from and accurately positioned with respect to one another, while the second device moves arcuately to produce a scanning effect. Advantageously, while one device, e.g. the ion source, is moved by a rotating shaft, the second device, e.g., the extraction electrode, moves on a curved track centered on the axis of the shaft. While the devices are disposed within respective parts of a vacuum chamber, a mechanical synchronizing mechanism, located outside of the chamber, moves the devices via seals. The specific mechanism shown comprises a driven lead screw, an insulating crank for driving a shaft on which an ion source is mounted, and an arcuate motion tracking device which transmits the motion of the insulating crank into the chamber for driving the extraction electrode upon a curved track.

Abstract: A machine which processes discrete wafer-form items in a chamber is provided with a slot-form channel along which the items move between points inside and outside the chamber, a lateral opening exposing the channel from its side, exposed walls of the channel defining a sealing margin directed toward that opening. A resilient sealing member is movable through the opening between an open position, in which the channel is not obstructed, and a sealing position, in which the sealing member resiliently engages the sealing margin. The machine shown is an ion implanter in which a beam of ions strikes the exposed item in the chamber. Features include a channel which makes an angle with the horizontal for gravity movement of the items; the sealing member serving as a stop to position an item along the length of the channel; and a plurality of openings and associated sealing members to provide locks on the sides of the chamber.