Abstract: This invention provides a method for fabricating buttable infrared detector arrays by dimensionally controlled cleaving of a single crystal wafer substrate having well defined cleavage planes. The single crystal wafer substrate is first cleaved along its natural cleavage planes so as to form a plurality of cleavage lines defining rectangular detector array regions. A layer of infrared sensitive material is epitaxially grown on the cleaved single crystal wafer substrate. Infrared detector arrays are fabricated on the layer of infrared sensitive material within the rectangular detector array regions defined by the cleavage lines on the single crystal wafer substrate. The fabricated infrared detector arrays are then separated at the cleavage lines so as to form individual buttable infrared detector arrays.

Abstract: An improved structure for interconnecting focal plane arrays. A first body having a first coefficient of expansion comprising a detector array is connected by interconnection apparatus to a second body having a second coefficient of expansion. The second body comprises semiconductor electronics and includes a bottom surface which opposes the surface connected to the first body. A layer of material is bonded with an adhesive to the second body's bottom surface wherein the bonded layer has a third coefficient of expansion which is greater than the first and second coefficients of expansion. In one aspect of the invention, the interconnection apparatus comprises interconnect columns made substantially of indium, the second body is substantially comprised of silicon and the first body is substantially comprised of material selected from the group consisting of CdTe and HgCdTe. The bonded layer may advantageously be substantially comprised of copper.

Abstract: Apparatus for electrically interconnecting a focal plane array component of infrared detectors to a second focal plane array component of electronics, such as multiplexers. First and second interconnecting members are comprised of indium bumps wherein the bumps are of generally rectangular shape and of nonparallel orientation, typically crossing at 90.degree. angles. An alternative embodiment uses bumps of generally round shape wherein one of the bumps is of a smaller surface area than the other.